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High-sealed SMD LED

A high-sealing, LED chip technology, used in lighting and heating equipment, electrical components, circuits, etc., can solve the problem of easy absorption of water vapor by silica gel, achieve good spot effect, improve brightness and lumen value.

Inactive Publication Date: 2010-05-26
深圳莱特光电股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above problems, the purpose of the present invention is to provide a high-seal SMD LED. This kind of LED only needs to add a small bowl to the bracket bowl to solve the problem that silica gel easily absorbs water vapor in the current LED package.

Method used

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Embodiment Construction

[0018] The core idea of ​​the present invention is: the present invention forms a "cup in a cup" structure by setting a small bowl in the bowl of the bracket, and a groove is also provided between the first bowl and the second bowl, and the second One bowl is filled with epoxy resin, and the second bowl is filled with fluorescent glue, so that the fluorescent glue has a good isolation effect from the air. Even if water vapor enters the bowl, it will only stay in the groove and will not affect The overall effect of LED; in addition, the epoxy resin filled in the first bowl and the fluorescent glue filled in the second bowl form a layer, and the epoxy resin on the upper layer is a transparent layer, which can form a convex lens and transmit light from the lower layer After the white light is filtered by the upper convex lens and secondly mixed, the brightness and lumen value of the finished product can be improved, and the consistency of the light output of the LED product can al...

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Abstract

The invention discloses a high-sealed SMD LED, which comprises a bracket. The bracket is provided with a first bowl, the bottom of the first bowl is provided with a second bowl, and a groove is formed between the bowl mouth at the upper end of the second bowl and the first bowl; and fluorescent glue is filled in the second bowl, and epoxy resin is filled in the first bowl. Compared with the prior art, one bowl is increased in the other bowl, the whole forms a bowl-in-bowl structure, and the epoxy resin isolates the fluorescent glue with the outside air through layered encapsulation, so the purpose of preventing moisture in the air from entering the fluorescent glue is achieved, meanwhile a convex lens formed through the epoxy rein can better control the consistency and light spot effect of a product, and the brightness of the finished product can be improved at the same time.

Description

technical field [0001] The invention relates to LED packaging technology, in particular to a highly sealed SMD LED. Background technique [0002] At present, most of the common SMD (Surface Mount Module) LEDs are packaged with silica gel in the production process. This is mainly because silica gel has good thermal conductivity. for encapsulation. [0003] Such as figure 1 as shown, figure 1 Schematic diagram of the structure of an existing surface mount component LED. Here, a bowl cup 101 is set on the bracket 1, and an LED chip 102 is fixed on the bottom of the bowl cup 101. The LED chip 102 is respectively connected to the positive and negative electrodes of the bracket through gold wires 103. When packaging silica gel, the silica gel 104 is packaged in the bowl cup. 101 in. The LED produced in this way, because the combination of the silica gel 104 and the inner wall of the bowl cup 101 is not good, it is easy to cause water vapor to enter from the junction between t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V9/10F21V23/00H01L33/00F21Y101/02F21K9/20F21V9/40F21Y115/10
Inventor 朱益明
Owner 深圳莱特光电股份有限公司