Insulation layer thermal-shrinkage furnace for capacitor

A heat shrinkable furnace and insulating layer technology, which is applied in capacitors, capacitor manufacturing, circuits, etc., can solve the problems of poor heat shrinkage performance, inability to use, and low yield

Inactive Publication Date: 2010-05-26
NANTONG HICON ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the requirements of environmental protection, conventional heat-shrinkable materials cannot be used because their additives contain toxic and harmful substances. The alternative insulation materials that meet environmental protection requirements have poor thermal shrinkage performance, poor appearance, and low yield.

Method used

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  • Insulation layer thermal-shrinkage furnace for capacitor
  • Insulation layer thermal-shrinkage furnace for capacitor

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0009] exist figure 1 In the process, the capacitor covered with the insulating protective layer enters the heat-shrinkable furnace under the conveying belt 5, and the electric heater 1 heats the insulating layer of the capacitor through the temperature control system. Plate 3 is hollow, and its entrance to air inlet at air outlet 4 places is from large to small in size, and air outlet baffle plate 2 is communicated with blower port, and outlet size is from high temperature section to low temperature section from large to small. The temperature of the furnace is heated by the electric heater 1, and the temperature of the furnace is regulated by the temperature controller with the temperature adjustment function. The motor drives the drum fan 6 to make the temperature in the furnace uniform. The gas flow direction of the gas plays a key role. When the capacitors covered with the insulating protective layer pass through, in sequence, at a temperature of 120°C-240°C and a flow ra...

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Abstract

The invention relates to an insulation layer thermal-shrinkage furnace for a capacitor. A capacitor coated with an insulation protection layer is conveyed to a thermal-shrinkage hearth by a conveying belt. A heater is used for heating the capacitor insulation layer by a temperature-control system. Wind return fences and wind outlet baffle plates are arranged in the furnace, wherein the wind return fences are hollow, and the sizes of the inlets of the wind return fences from a wind outlet to a wind inlet are gradually reduced; the wind outlet baffle plates are provided with draught openings, and the sizes of the outlets from the high-temperature section to the low-temperature section are gradually reduced. The wind return fences and the wind outlet baffle plates from the high-temperature section to the low-temperature section are arranged in a gradually reduced way, and then the flow direction and the flow quantity of the hot gas can be adjusted.

Description

1. Technical field [0001] The invention relates to a heat shrinking furnace for the insulating layer of a capacitor. 2. Background technology [0002] At present, most of the surfaces of aluminum electrolytic capacitors are covered with one or more layers of insulating protective layers to prevent the aluminum shell of the capacitor from contacting with the circuit board or other electronic components to form a short circuit. With the requirements of environmental protection, conventional heat-shrinkable materials cannot be used due to the toxic and harmful substances contained in their additives. The alternative insulation materials that meet the requirements of environmental protection have poor thermal shrinkage performance, poor appearance, and low yield. 3. Contents of the invention [0003] The invention provides a heat-shrinking furnace for insulating layers of capacitors which ensures that the temperature in the furnace is within a certain range. [0004] The tech...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G13/00
Inventor 顾义明赵建保毛建蒋志兵
Owner NANTONG HICON ELECTRONICS
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