Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Laser processing method and apparatus

A laser processing method and laser processing technology, applied in the directions of laser welding equipment, metal processing equipment, installation, etc., can solve the problem of not improving the laser utilization efficiency, and achieve the effects of improving the utilization efficiency, efficient change, and easy rotation control.

Inactive Publication Date: 2010-06-09
OLYMPUS CORP
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although it is possible to change the incident angle of the microscope to enter a diffraction order, even this cannot improve the utilization efficiency of the laser

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser processing method and apparatus
  • Laser processing method and apparatus
  • Laser processing method and apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0060] A laser processing apparatus according to a first embodiment of the present invention will be described.

[0061] Such as figure 1 As shown, the laser processing apparatus 100 of this embodiment is an apparatus that divides wavelengths by λ 2 ,λ 3 Laser L 2 , L 3 as modulated light L M Laser processing is performed by irradiating the workpiece 15 .

[0062] Examples of the workpiece 15 include glass substrates, semiconductor substrates, and the like used in liquid crystal displays and the like. In this case, the processing target includes a wiring pattern on a substrate, a defect such as a useless residue existing on a photomask used for exposure, and the like.

[0063] Although not particularly shown, if necessary, the workpiece 15 is held on a mounting table having, for example, a holding mechanism for fixing a position during processing, an adsorption mechanism, and a moving mechanism for moving a processing position. In addition, when used in a microdissecti...

no. 2 Embodiment approach

[0128] A laser processing apparatus according to a second embodiment of the present invention will be described.

[0129] Figure 5 It is a schematic explanatory drawing for demonstrating the schematic structure of the laser processing apparatus 110 which concerns on 2nd Embodiment of this invention.

[0130] Such as Figure 5 As shown, the laser processing apparatus 110 of this embodiment has the laser source 130 instead of the laser oscillator 1 of the laser processing apparatus 100 of 1st Embodiment of this invention. The following description will focus on differences from the first embodiment.

[0131] The laser source 130 oscillates laser light L of different wavelengths in a pulsed manner A , L B (Wavelengths are λ A ,λ B ), a laser source that emits them as approximately parallel beams onto the same optical path. Its schematic structure consists of laser oscillators 1A, 1B, and a dichroic mirror 2 .

[0132] Laser L A , L B The size of the beam diameter can f...

no. 3 Embodiment approach

[0153] Next, a laser processing apparatus according to a third embodiment of the present invention will be described.

[0154] Image 6 It is a schematic explanatory drawing for demonstrating the schematic structure of the laser processing apparatus 200 which concerns on 3rd Embodiment of this invention.

[0155] Such as Image 6 As shown, the laser processing apparatus 200 of this embodiment divides the wavelengths by λ according to the processing pattern 2 , lambda 3 Laser L 2 , L 3 as modulated light L M Laser processing is performed by irradiating the workpiece 15 .

[0156] The laser light L can be used differently according to the wavelength absorption characteristics of the workpiece 15, etc. 2 , L 3 .

[0157] The general structure of laser processing device 200 is to be made up of following parts: laser oscillator 1 (laser source), tilt table 104 (rotation mechanism), micromirror array 7 (spatial modulator element, active optical element), tilt table 105 (rot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
wavelengthaaaaaaaaaa
Login to View More

Abstract

Disclosed is a laser processing method and apparatus. The laser processing method of the invention comprises: the mode of irradiating lasers from the laser oscillator (1) for generating lasers (L2, L3) to a micro reflectors array (7) composed by a plurality of micro reflectors arranged regularly is converted into that: a modulation light (LM) having the section shapes corresponding to the processing figure of the processed object (15) is irradiated on the processed object (15) through an irradiation optical system (20) for performing laser processing; wherein the direction of the optical axis(202) of the optical system (20) is arranged approximately consistent with the direction of the diffracted light generated by the lasers (L2, L3) on the micro reflectors array (7).

Description

[0001] This application is a divisional application of an invention patent application with an application date of June 14, 2006, an application number of 200610092201.4, and an invention title of "laser processing method and device". technical field [0002] The invention relates to a laser processing method and device. For example, it relates to a laser processing method and apparatus for removing, cutting, and the like of a predetermined region of a workpiece by irradiating laser light. [0003] This application claims priority based on Japanese Patent Application No. 2005-178286 filed on June 17, 2005 and Japanese Patent Application No. 2005-187829 filed on June 28, 2005, the contents of which are incorporated herein. Background technique [0004] Conventionally, there is known a laser processing apparatus that processes a desired region of a workpiece by irradiating laser light. For example, in the manufacture of liquid crystal displays or the like, a laser repair devi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/04B23K26/064B23K26/042
CPCB23K26/032B23K26/0643B23K26/042G02B7/198
Inventor 松沢聪明中村达哉
Owner OLYMPUS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com