Static discharge protective structure
An electrostatic discharge protection and voltage source technology, applied in circuits, electrical components, electric solid devices, etc., can solve problems such as electrostatic discharge, integrated circuit damage, and no integrated circuit, and achieve the effect of avoiding damage
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0031] figure 1 It is a structure diagram of electrostatic discharge protection according to an embodiment of the present invention. Wherein the integrated circuit (hereinafter referred to as the chip) 101 is arranged in the ring inner region 115 of the ground ring 110, the ground ring 110 surrounds the periphery of the chip 101, and the outer edge of the ground ring 110 has a plurality of sawtooth structures 120-129, each of which The structures 120-129 respectively have a sharp end (such as 121a), and the sharp ends of each of the sawtooth structures 120-129 are respectively adjacent to the corresponding pads 130-139, such as figure 1 shown.
[0032] Taking the sawtooth structure 121 as an example, it is located on the outer edge of the ground ring 110 , and its sharp end 121 a is adjacent to the corresponding pad 131 . There is a gap between the sharp end 121a of the sawtooth structure 121 and the soldering pad 131 (that is, the sharp end 121a is not in contact with the s...
no. 2 example
[0038] In another embodiment of the present invention, the above-mentioned grounding rings 110 and 210 can also be directly set as a grounding area, and the entire surface of the area is covered with copper instead of a hollow ring structure. Please refer to image 3 , image 3 It is a structure diagram of the electrostatic discharge protection according to the second embodiment of the present invention. in image 3 and figure 1 The main difference lies in the grounding area 115 and the grounding ring 110, image 3 The grounding area 115 in is an area covered with copper (not hollow) on the entire surface, and the integrated circuit 101 is directly arranged on the grounding area 115, and figure 1 The ground ring 110 is a ring structure.
[0039] Due to the packaging requirements of some integrated circuits 101, in order to reduce costs, the bare die will be directly packaged on the printed circuit board, and metal wires (aluminum wires, gold wires or metal wires of mixed ...
no. 3 example
[0043] The above-mentioned first and second embodiments mainly focus on the structure of the grounding area and the grounding ring. In another embodiment of the present invention, a corresponding design can also be made on the structure of the pad to increase its electrostatic discharge protection capability. . In this embodiment, one end of the welding pad can also be designed to be sharp, and the sharp end of the welding pad is adjacent to the sharp end of the sawtooth structure. Since the adjacent ends of the welding pad and the sawtooth structure are both sharp ends, using the principle of tip discharge, electrostatic discharge is more likely to occur at the adjacent sharp ends, thereby improving the protection effect of electrostatic discharge. Next, please refer to Figure 5 , Figure 5 It is a partial structural diagram of the electrostatic discharge protection structure according to the third embodiment of the present invention. Figure 5 include Figure 4 The part...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More