Cleaning method of probe and chip socket

Abstract

The invention relates to a cleaning method of a probe and a chip socket, comprising the following steps of: removing the probe from the chip socket; spraying liquid carbon dioxide on the surface of the probe or the chip socket; putting the probe or the chip socket into a vacuum environment for solidifying the liquid carbon dioxide into solid carbon dioxide; putting the probe or the chip socket into a temperature control environment for vaporizing the solid carbon dioxide into gaseous carbon dioxide; and at the same time, absorbing away the gaseous carbon dioxide coating a pollution source. The cleaning method can be used for effectively cleaning the probe and the chip socket.

Description

technical field [0001] The invention relates to a method for cleaning probes and chip sockets, in particular to an effective method for cleaning probes and chip sockets. Background technique [0002] The function of the chip socket (IC Socket) is to electrically connect the contacts of the chip (such as solder balls or pads, etc.) to several contacts of the circuit board for testing. [0003] figure 1 It is a schematic cross-sectional view of a known chip socket. The chip socket 1 has a housing 6. The housing 6 has a positioning surface 2 for accommodating a chip 3. There are a plurality of probes 5 below the positioning surface 2, respectively. Through the plurality of holes 7 , the plurality of probes 5 are used to make contact with the chip 3 . When the chip 3 is placed on the positioning surface 2, the plurality of contacts 4 below the chip 3 are in contact with the upper end of the plurality of probes 5 respectively, and the lower end of the plurality of probes 5 will...

AI Technical Summary

Problems solved by technology

The existing cleaning method does not specifically clean the inner wall of the hole 7, but the pollution source 8 on the inner wall of the hole 7 has been observed to have a serious impact on the test, especially in the high-frequency test, the length of the probe 5 is shorter, and the impact is greater; and , the pollution source 8 attached to the probe 5 or the chip socket 1 not only has a single type but contains many types, for example, the common pollution source 8 has metal oxide, passivation (passivation), nitrogen silicon compound, polymer, grinding Lapping compounds, adhesive residues, outgas compounds, metal substances, sources of human pollution, cleaning agent residues, solder flux, etc.

Therefore, using a single mechanical energy or chemical energy will not be able to completely remove all pollution sources 8, resulting in the inability to clean the probe 5 or the chip socket 1.

If the probe 5 or the chip socket 1 cannot be cleaned immediately during the test, these pollution sources 8 will cross-contaminate each other, making the pollution situation more serious, and then greatly increasing the cost of consumables such as the probe 5 and the chip socket 1, and reduce test yield

[0007] This shows that above-mentioned existing cleaning method of probe and chip socket obviously still has inconvenience and defect in method and use, and urgently needs to be further improved

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general method has no suitable method to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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