The invention discloses an oxygen-control type pipeline-corrosion-resistant liquid metal for 40-80 DEG c of an electronic chip and a process thereof. The alloy comprises the following components in percentage, by weight, the alloy composition is 0.2-0.5wt% of Hf, 0.4-1.0wt% of Co, 4.0-8.0wt% of Bi, 2.0-5.0wt% of Zn, 5.0-10.0wt.% of In,1.0-2.0wt.% of Cd, 5.0-8.0wt.% of Pb, and the balance of gallium; wherein the oxide composition for controlling the oxygen activity is pbo: 30.0-40.0wt% of PbO, 2.0-4.0wt% of CuO,10.0-20.0wt% of AgO, 4.0-6.0wt% of CdO, 5.0-8.0wt% of NiO, and the balance of Fe2O3.Through controlling the oxygen activity by adopting an oxygen control module, the stable compact oxidation film can be effectively generated on the surface of the stainless steel pipeline to inhibitcorrosion of the liquid metal to the pipeline material, the method has the characteristics that the process is simple, the implementation cost is low, the heat dissipation is efficient, the service life of the heat dissipation component is prolonged, and the service life of the heat dissipation component is obvious.