Street light fitting with luminous diode heat radiating device
A technology of light-emitting diodes and heat sinks, which is applied to components of lighting devices, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc., to achieve the effect of ensuring life
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Embodiment 1
[0017] This embodiment is a street lamp with a light-emitting diode cooling device. The shape of the lamp is as follows: figure 1 As shown, the internal structure is as figure 2 shown. The present embodiment has a lamp box, the lower box body 2 of the lamp box is provided with a lighting window 3, and a transparent lampshade is installed on the lighting window. The lower box body is equipped with an upper box body 1, the upper box body and the lower box body can be connected together by a hinge, and locked with a locking device in the closed state, or can be fastened together with screws, or with elastic clips, stuck together. The upper box and the lower box are made of metal materials with good thermal conductivity, such as aluminum alloy, stainless steel, brass, etc., so that the heat in the box can be effectively dissipated to the outside of the box. An arched skeleton 5 with an arched cross section is arranged in the lower box body. This arched skeleton is the center o...
Embodiment 2
[0023] This embodiment is an improvement of the rapid heat dissipation printed circuit board described in the first embodiment. The cross-sectional schematic diagram of the rapid heat dissipation metal-based printed circuit board described in this embodiment is as follows Figure 4 shown. The rapid heat dissipation metal-based printed circuit board 41 described in this embodiment includes: a copper foil layer 411 formed of a copper foil that can dissipate heat and conduct electricity, and is connected to the light-emitting diode 42 by heat conduction; Nano-coating 412 , an insulating layer 413 combined with the heat-absorbing nano-coating, a metal-based layer 414 as a substrate of a printed circuit board combined with the insulating layer, and a heat-radiating nano-coating 415 combined with the metal-based layer.
[0024] The copper foil layer in this embodiment is basically the same as the copper foil layer of a common printed circuit board, but in addition to having a condu...
Embodiment 3
[0026] This embodiment is an improvement of the light-emitting module described in the second embodiment, which is an improvement of the metal base layer of the fast-dissipating metal-based printed circuit board on the light-emitting module. The metal of the metal base layer of the rapid heat dissipation metal-based printed circuit board described in this embodiment uses a steel plate with iron as the main component.
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