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Oxygen-control type pipeline-corrosion-resistant liquid metal for 40-80 DEG c of electronic chip and process thereof.

An electronic chip and liquid metal technology, applied in the field of gallium alloy, can solve problems such as cooling system failure, circuit board short circuit, pipeline cracking, etc., and achieve the effect of solving industry problems, low repair cost, and fast response speed.

Inactive Publication Date: 2019-10-18
深圳市兴荣晟物业管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, in the driving mode of the electromagnetic pump, the pipe material may crack due to the erosion of liquid metal after a period of use, and eventually cause the heat dissipation system to fail
Moreover, since liquid metal is a conductive material, the leaked liquid liquid metal will also cause a short circuit on the circuit board, resulting in a substantial failure

Method used

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  • Oxygen-control type pipeline-corrosion-resistant liquid metal for 40-80 DEG c of electronic chip and process thereof.

Examples

Experimental program
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Effect test

Embodiment 1

[0019] An oxygen-controlling type pipeline corrosion-resistant liquid metal used for electronic chips at 40-80 degrees and a process thereof. In terms of weight percentage, the alloy composition is Hf: 0.2wt.%, Co: 0.5wt.%, Bi: 4.2wt.%, Zn: 2.8wt.%, In: 6.0wt.%, Cd: 1.5t.% , Pb: 6.0wt.%, the balance is gallium; the oxide composition that controls the oxygen activity is PbO: 38.0wt.%, CuO: 2.0wt.%, AgO: 10.0wt.%, CdO: 4.0wt.% , NiO: 5.0wt.%, the balance is Fe 2 O 3 .

[0020] The above-mentioned oxygen-controlled pipeline corrosion-resistant liquid metal for 40-80 degrees for electronic chips and its process include the following processing and use steps: (a) After the alloy is configured according to the required composition, it is placed in an induction furnace for smelting , And use a graphite crucible for smelting under the protection of argon; after the alloy melt is fully stirred evenly by electromagnetic stirring at 200 degrees for 10 minutes, after cooling, remove the scu...

Embodiment 2

[0023] An oxygen-controlling type pipeline corrosion-resistant liquid metal used for electronic chips at 40-80 degrees and a process thereof. In terms of weight percentage, the alloy composition is Hf: 0.5wt.%, Co: 0.9wt.%, Bi: 7.0wt.%, Zn: 4.0wt.%, In: 8.0wt.%, Cd: 1.8wt.% , Pb: 6.0wt.%, the balance is gallium; the oxide composition that controls the oxygen activity is PbO: 38.0wt.%, CuO: 3.5wt.%, AgO: 16.0wt.%, CdO: 5.8wt.% , NiO: 7.0wt.%, the balance is Fe 2 O 3 .

[0024] The above-mentioned oxygen-controlled pipeline corrosion-resistant liquid metal for 40-80 degrees for electronic chips and its process include the following processing and use steps: (a) After the alloy is configured according to the required composition, it is placed in an induction furnace for smelting , And use a graphite crucible for smelting under the protection of argon; after holding at 280 degrees for 10 minutes, use electromagnetic stirring to fully stir the alloy melt evenly, after cooling, remove...

Embodiment 3

[0027] An oxygen-controlling type pipeline corrosion-resistant liquid metal used for electronic chips at 40-80 degrees and a process thereof. In terms of weight percentage, the alloy composition is Hf: 0.3wt.%, Co: 0.5wt.%, Bi: 5.0wt.%, Zn: 3.0wt.%, In: 6.0wt.%, Cd: 1.5wt.% , Pb: 6.0wt.%, the balance is gallium; the oxide composition that controls the oxygen activity is PbO: 35.0wt.%, CuO: 2.8wt.%, AgO: 14.0wt.%, CdO: 5.0wt.% , NiO: 6.0wt.%, the balance is Fe 2 O 3 .

[0028] The above-mentioned oxygen-controlled pipeline corrosion-resistant liquid metal for 40-80 degrees for electronic chips and its process include the following processing and use steps: (a) After the alloy is configured according to the required composition, it is placed in an induction furnace for smelting , And use a graphite crucible for smelting under the protection of argon; after the alloy melt is fully stirred evenly by electromagnetic stirring at 250 degrees for 10 minutes, after cooling, remove the sc...

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Abstract

The invention discloses an oxygen-control type pipeline-corrosion-resistant liquid metal for 40-80 DEG c of an electronic chip and a process thereof. The alloy comprises the following components in percentage, by weight, the alloy composition is 0.2-0.5wt% of Hf, 0.4-1.0wt% of Co, 4.0-8.0wt% of Bi, 2.0-5.0wt% of Zn, 5.0-10.0wt.% of In,1.0-2.0wt.% of Cd, 5.0-8.0wt.% of Pb, and the balance of gallium; wherein the oxide composition for controlling the oxygen activity is pbo: 30.0-40.0wt% of PbO, 2.0-4.0wt% of CuO,10.0-20.0wt% of AgO, 4.0-6.0wt% of CdO, 5.0-8.0wt% of NiO, and the balance of Fe2O3.Through controlling the oxygen activity by adopting an oxygen control module, the stable compact oxidation film can be effectively generated on the surface of the stainless steel pipeline to inhibitcorrosion of the liquid metal to the pipeline material, the method has the characteristics that the process is simple, the implementation cost is low, the heat dissipation is efficient, the service life of the heat dissipation component is prolonged, and the service life of the heat dissipation component is obvious.

Description

Technical field [0001] The invention relates to the technical field of alloys, in particular to a gallium alloy. Background technique [0002] The main factors that determine heat dissipation and heat conduction in electronic chips are: chip integration density, copper foil thickness, trace width and so on. In the actual use process, the application environment of the product, the production process of the circuit board and the quality of the board should also be considered. The increase in chip integration density will cause the axis of the circuit board to generate heat after continuous current, which will cause the chip temperature to rise. What is especially serious is that the rise in temperature not only activates the self-protection mechanism of the chip, but also deforms the substrate when the temperature rises to the allowable temperature of the substrate, which affects the bonding force between the copper foil wire and the substrate, and ultimately leads to structural ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C28/00C22C32/00C23C26/00
CPCC22C28/00C22C32/001C23C26/00
Inventor 王金辉
Owner 深圳市兴荣晟物业管理有限公司
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