The invention discloses an
oxygen-control type pipeline-
corrosion-resistant
liquid metal for 40-80 DEG c of an
electronic chip and a process thereof. The
alloy comprises the following components in percentage, by weight, the
alloy composition is 0.2-0.5wt% of Hf, 0.4-1.0wt% of Co, 4.0-8.0wt% of Bi, 2.0-5.0wt% of Zn, 5.0-10.0wt.% of In,1.0-2.0wt.% of Cd, 5.0-8.0wt.% of Pb, and the balance of
gallium; wherein the
oxide composition for controlling the
oxygen activity is pbo: 30.0-40.0wt% of PbO, 2.0-4.0wt% of CuO,10.0-20.0wt% of AgO, 4.0-6.0wt% of CdO, 5.0-8.0wt% of NiO, and the balance of Fe2O3.Through controlling the
oxygen activity by adopting an oxygen control module, the stable compact oxidation film can be effectively generated on the surface of the stainless
steel pipeline to inhibitcorrosion of the
liquid metal to the pipeline material, the method has the characteristics that the process is simple, the implementation cost is low, the heat dissipation is efficient, the service life of the heat dissipation component is prolonged, and the service life of the heat dissipation component is obvious.