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Electronic chip 120-180 degree oxygen control type pipeline corrosion resisting type liquid metal and technology thereof

An electronic chip and liquid metal technology, applied in the field of gallium alloy, can solve the problems of heat dissipation system failure, circuit board short circuit, pipeline cracking, etc., to achieve high heat transfer coefficient, low repair cost, and solve industry problems.

Inactive Publication Date: 2019-10-11
深圳市兴荣晟物业管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, in the driving mode of the electromagnetic pump, the pipe material may crack due to the erosion of liquid metal after a period of use, and eventually cause the heat dissipation system to fail
Moreover, since liquid metal is a conductive material, the leaked liquid liquid metal will also cause a short circuit on the circuit board, resulting in a substantial failure

Method used

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  • Electronic chip 120-180 degree oxygen control type pipeline corrosion resisting type liquid metal and technology thereof

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Effect test

Embodiment 1

[0019] An oxygen-controlling pipeline corrosion-resistant liquid metal for electronic chips at 120-180 degrees and its technology. In terms of weight percentage, the alloy composition is Sn: 4.2wt.%, Au: 0.2wt.%, Hg: 1.5wt.%, Zn: 8.0wt.%, In: 20.5wt.%, Cd: 4.0wt.% , Pb: 2.0wt.%, the balance is gallium; the oxide composition to control the oxygen activity is PbO: 12.0wt.%, Bi 2 o 3 :6.0wt.%, ZnO:2.0wt.%, CdO:1.0wt.%, In 2 o 3 :5.0wt.%, the balance is Fe 2 o 3 .

[0020] The above-mentioned oxygen-controlled pipe corrosion-resistant liquid metal for 120-180 degrees of electronic chip and its process include the following processing and use steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting , and use a graphite crucible for smelting under the protection of argon; heat the alloy at 200 degrees for 10 minutes and use electromagnetic stirring to fully stir the alloy melt evenly. After cooling, remove t...

Embodiment 2

[0023] An oxygen-controlling pipeline corrosion-resistant liquid metal for electronic chips at 120-180 degrees and its technology. In terms of weight percentage, the alloy composition is Sn: 5.0wt.%, Au: 0.4wt.%, Hg: 2.8wt.%, Zn: 9.0wt.%, In: 28.0wt.%, Cd: 4.8wt.% , Pb: 2.5wt.%, the balance is gallium; the oxide composition to control the oxygen activity is PbO: 14.0wt.%, Bi 2 o 3 :9.0wt.%,ZnO:4.0wt.%,CdO:2.0wt.%,In 2 o 3 :9.0wt.%, the balance is Fe 2 o 3 .

[0024] The above-mentioned oxygen-controlled pipe corrosion-resistant liquid metal for 120-180 degrees of electronic chip and its process include the following processing and use steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting , and use a graphite crucible for smelting under the protection of argon; heat the alloy at 300 degrees for 10 minutes and use electromagnetic stirring to fully stir the alloy melt evenly. After cooling, remove the ...

Embodiment 3

[0027] An oxygen-controlling pipeline corrosion-resistant liquid metal for electronic chips at 120-180 degrees and its technology. In terms of weight percentage, the alloy composition is Sn: 5.0wt.%, Au: 0.3wt.%, Hg: 1.5wt.%, Zn: 8.6wt.%, In: 25.0wt.%, Cd: 4.0wt.% , Pb: 3.0wt.%, the balance is gallium; the oxide composition to control the oxygen activity is PbO: 10.0-15.0wt.%, Bi 2 o 3 :5.0-10.0wt.%, ZnO:2.0-5.0wt.%, CdO:1.0-3.0wt.%, In 2 o 3 :5.0-10.0wt.%, the balance is Fe 2 o 3 .

[0028] The above-mentioned oxygen-controlled pipe corrosion-resistant liquid metal for 120-180 degrees of electronic chip and its process include the following processing and use steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting , and use graphite crucible for smelting under the protection of argon; heat the alloy at 200 degrees for 10 minutes and use electromagnetic stirring to fully stir the alloy melt evenly. Af...

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Abstract

The invention discloses electronic chip 120-180 degree oxygen control type pipeline corrosion resisting type liquid metal and a technology thereof. Alloy consists of the following components in a percent by weight: 4.0-6.0wt% of Sn, 0.2-0.5wt% of Au, 1.0-3.0wt% of Hg, 8.0-10.0wt% of Zn, 20.0-30.0wt% of In, 4.0-5.0wt% of Cd, 2.0-4.0wt% of Pb and the balance of Ga. Oxides for controlling oxygen activity consist of the following components in a percent by weight: 10.0-15.0wt% of PbO, 5.0-10.0wt% of Bi2O3, 2.0-5.0wt% of ZnO, 1.0-3.0wt% of CdO, 5.0-10.0wt% of In2O3 and the balance of Fe2O3. By encapsulating the liquid metal in a pipeline and using an oxygen control module to control oxygen activity, a stable and dense oxide film can be effectively produced on the surface of the stainless steelpipeline to inhibit the corrosion of the liquid metal to the pipeline material. The technology is characterized in simple technical process, low implementing fees, efficient cooling, the prolonging ofthe service life of a cooling component and remarkable effect.

Description

technical field [0001] The invention relates to the technical field of alloys, in particular to a gallium alloy. Background technique [0002] The factors that determine heat dissipation and heat conduction in electronic chips mainly include: chip integration density, copper foil thickness, trace width, etc. In the actual use process, the application environment of the product, the manufacturing process of the circuit board and the quality of the board should also be considered. Due to the increase of chip integration density, the axis of the circuit board will generate heat after continuous current, which will cause the temperature of the chip to rise. What is more serious is that the rise in temperature not only causes the chip to activate the self-protection mechanism, but also the substrate will deform when the temperature rises to the allowable temperature of the substrate, which will affect the bonding force between the copper foil wire and the substrate, and eventual...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C28/00C22C30/06H01L23/373H01L23/473C04B30/00
CPCC04B30/00C22C28/00C22C30/04C22C30/06H01L23/3736H01L23/473C04B14/30C04B14/308
Inventor 王金辉
Owner 深圳市兴荣晟物业管理有限公司
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