Coating equipment

Abstract

The invention provides coating equipment. The coating equipment comprises a reaction chamber and a movable support device, wherein the reaction chamber is provided with a reaction cavity, and the movable support device is accommodated in the reaction cavity. The movable support device comprises at least one electrode and a movable support, wherein the movable support can move relative to the reaction cavity, the at least one electrode is arranged on the movable support in a manner of being movable along with the movable support, and at least one workpiece to be coated is suitable for being kept on the movable support to move along with the movable support.

Description

technical field [0001] The invention relates to the field of film coating, in particular to film coating equipment. Background technique [0002] The coating can protect the surface of the material and endow the material with good physical and chemical durability. Some coatings, such as polymer coatings, have certain anti-corrosion properties. They form a protective film layer on the surface of electronic components such as electronic appliances and circuit boards, which can effectively protect the circuit from erosion and damage in a corrosive environment, thereby improving reliability of electronic components. [0003] During the coating process, the workpiece to be coated needs to be placed in the reaction chamber, and then the reaction gas is introduced. Under the action of plasma, the reaction gas is deposited on the surface of the workpiece to be coated by chemical vapor deposition to form a coating. During this process, continuous vacuuming is required so that the ...

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Problems solved by technology

But at the same time, it is also found in practical applications that this electrode setup leads to a slow deposition rate, and some monomers that require high-energy plasma activation cannot be effectively excited into a plasma state, which limits their use.

In addition, for most of the current plasma coating devices on the market, the position between the electrode and the reaction chamber is relatively fixed, the discharge position of the electrode is fixed, and only a fixed discharge environment is provided to the reaction chamber.

And when the stage rotates, the discharge of the electrode may be affected by the stage, and the rotating stage acts as a shield, which may affect the yield of the product in the end

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