Field effect transistor device using carbon nano tube as electrode and preparation method thereof
A field effect transistor and carbon nanotube technology, which is applied in the field of field effect transistor devices and their preparation to achieve the effects of high application value and high response sensitivity
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Embodiment 1
[0030] Embodiment 1, preparation carbon nanotube transistor device
[0031] The preparation method of the carbon nanotube transistor device includes the following steps in sequence:
[0032] 1) Mesoporous SiO doped with CoMo 2 Particles act as a catalyst that is uniformly distributed on SiO on the surface of a heavily doped silicon substrate 2 layer; the SiO 2 The layer is grown on the silicon wafer by the thermal evaporation method with a thickness of 300nm; using ethanol as the carbon source, using the CVD method on SiO 2 A layer of single-walled carbon nanotubes is obtained on top of the layer. The single-walled carbon nanotube layer is located in the center of the silicon substrate.
[0033] Afterwards, a metal mask is covered on the single-walled carbon nanotube layer, and a Cr layer and an Au layer are sequentially obtained by using a thermal evaporation method, and Au / Cr is used as a source region and a drain region of the carbon nanotube transistor device. Wherein...
Embodiment 2
[0042] Embodiment 2, preparation carbon nanotube transistor device
[0043] The preparation method of the carbon nanotube transistor device includes the following steps in sequence:
[0044] 1) Mesoporous SiO doped with CoMo 2 Particles act as a catalyst that is uniformly distributed on SiO on the surface of a heavily doped silicon substrate 2 layer; the SiO 2 The layer is grown on the silicon wafer by the thermal evaporation method with a thickness of 300nm; using ethanol as the carbon source, using the CVD method on SiO 2 A layer of single-walled carbon nanotubes is obtained on top of the layer. The single-walled carbon nanotube layer is located in the center of the silicon substrate.
[0045] Afterwards, a metal mask is covered on the single-walled carbon nanotube layer, and a Cr layer and an Au layer are sequentially obtained by using a thermal evaporation method, and Au / Cr is used as a source region and a drain region of the carbon nanotube transistor device. Wherein...
Embodiment 3
[0054] Embodiment 3, preparation carbon nanotube transistor device
[0055] 1) Mesoporous SiO doped with CoMo 2 Particles act as a catalyst that is uniformly distributed on SiO on the surface of a heavily doped silicon substrate 2 layer; the SiO 2 The layer is grown on the silicon wafer by the thermal evaporation method with a thickness of 300nm; using ethanol as the carbon source, using the CVD method on SiO 2 A layer of single-walled carbon nanotubes is obtained on top of the layer. The single-walled carbon nanotube layer is located in the center of the silicon substrate.
[0056] Afterwards, a metal mask is covered on the single-walled carbon nanotube layer, and a Cr layer and an Au layer are sequentially obtained by using a thermal evaporation method, and Au / Cr is used as a source region and a drain region of the carbon nanotube transistor device. Wherein, the distance between the two electrodes is 20 μm, the thickness of the Cr layer is 5 nm, and the thickness of the ...
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