Radiation device
A technology of heat sink and radiator, which is applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating renovation, etc., can solve the problems of increasing the thermal resistance of the base and the heat pipe, poor stability, and affecting the heat dissipation efficiency of the heat sink. , to achieve the effect of improving heat conduction efficiency, simple operation and small footprint
Active Publication Date: 2010-06-16
JIANGSU LIANZHONG CASING
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Problems solved by technology
However, as the number of heat pipes increases, the span between the heat pipes and the heat sink increases. This method of fixing the heat pipes not only has poor stability, but also greatly increases the thermal resistance between the base and the heat pipes, which is not conducive to the rapid passage of heat concentrated on the bottom plate. The heat pipe conducts to the heat sink, which affects the heat dissipation efficiency of the heat sink
Method used
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[0011] see figure 1 and figure 2 , the heat dissipation device in an embodiment of the present invention is used to dissipate heat from heat-generating electronic components (not shown in the figure). The heat dissipation device includes a heat sink 10 , a plurality of heat pipes passing through the heat sink 10 , a heat conduction plate 30 attached to the bottom of the heat pipe, and a positioning member 40 between the heat sink 10 and the heat conduction plate 30 for fixing the heat pipe. The heat conducting plate 30 is in direct contact with a main heat-generating electronic component to absorb its heat.
[0012] The heat sink 10 is made of a material with better heat dissipation performance, and includes a plurality of rectangular cooling fins 12 arranged parallel to each other, and each cooling fin 12 is provided with a hole 120 for a heat pipe to pass through.
[0013] In this embodiment, there are four heat pipes, among which three first heat pipes 20 are closely arr...
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The invention discloses a radiation device, which comprises a heat conducting plate, a plurality of heat tubes and a radiator and also comprises positioning piece, wherein the heat conducting plate is attached to a heating electronic element; the plurality of heat tubes are attached to the heat conducting plate; the radiator is positioned on the heat conducting plate, and the heat tubes are inserted in the radiator; the positioning piece is arranged between the radiator and the heat conducting plate and used for tightly pressing and fixing the heat tubes; the positioning piece comprises a fixed plate and a pressure plate which is arranged across the fixed plate for tightly pressing and fixing the heat tubes; and the heat tubes are clamped between the pressure plate and the heat conductingplate. In the invention, the heat tubes are tightly pressed and fixed on the heat conducting plate by the compactly structured positioning piece, so the big heat resistance and the poor stability which are caused by directly welding and fixing the heat tubes on the heat conducting plate are avoided, and the efficiency of heat conduction between the heat tubes and the heat conducting plate is improved efficiently; meanwhile, the radiation device is simple to operate, occupies a small space and preserves enough space for other fasteners.
Description
technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a fixed structure. Background technique [0002] With the continuous development of the electronic industry, the operating speed and overall performance of electronic components (especially the central processing unit) are constantly improving, and the heat generated by them is also increasing. In order to make the electronic components work normally, the industry generally installs a heat sink on the electronic components to dissipate heat. Usually, the heat dissipation device includes a base attached to the heat-generating electronic components, a plurality of cooling fins extending upward from the base, and a plurality of heat pipes connecting the base and the cooling fins. Usually, the heat pipe is welded directly on the base. However, as the number of heat pipes increases, the span between the heat pipes and the heat sink increases. This method of...
Claims
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IPC IPC(8): H05K7/20H01L23/34H01L23/427
CPCF28D15/0275H01L23/427H01L2924/0002H01L2924/00
Inventor 李武吴宜强陈俊吉
Owner JIANGSU LIANZHONG CASING