Adhesive block film for flexible printed circuit board fast compression technology

Abstract

The invention discloses an adhesive block film for a flexible printed circuit board fast compression technology, which is formed by compounding a copperplate paper layer and an adhesive block layer. The adhesive block film is characterized in that the adhesive block layer sequentially comprises a polyethylene layer, a polyethylene-nylon permeation layer and a nylon layer from insides to outsides. The invention has favorable adhesive leakage resistance performance, can ensure the smoothness in the circuit board compression process, is also suitable for a manufacture technology of soft plate pierced plates and can be used for various flexible printed circuit board laminating presses.

Description

technical field [0001] The invention relates to a glue-resistant film used in the lamination process of flexible printed circuit boards, which is used to play the role of release and anti-overflow when laminating the protective film, and specifically relates to a fast pressing film for flexible printed circuit boards. Adhesive barrier film used in lamination process. Background technique [0002] Compared with ordinary printed circuit boards, flexible printed circuit boards (Flexible Printed Circuit, referred to as FPC) are flexible, and have the advantages of easy bending, light weight, and thin thickness. Therefore, they are often used in applications that require thin and light designs or Products designed with movable mechanisms, such as mobile phones, notebook computers, monitors, consumer electronics and touch screen panels, etc. [0003] The structure of the flexible printed circuit board product is composed of a flexible copper foil substrate (FCCL) and a flexible i...

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Problems solved by technology

[0006] However, in actual use, it is found that there are the following problems: when PE material is used, (1) due to the low melting point of PE material, it will melt when it encounters high temperature, and some PE will remain on the FPC after pressing, which will easily lead to circuit board disconnection (2) The thickness of the PE is usually only 20um, and it can be used normally in the case of some single-sided boards and the surface of the circuit board is relatively flat. (3) Since the temperature resistance of PE is not enough, in order to avoid the residual phenomenon, the product should be taken out after pressing and cooled before peeling off, but peeling off after cooling will cause the circuit board to shrink. Stable, affecting the subsequent drilling steps, resulting in air breakage; (4) The softening point of PE is low, and the product is prone to curling and shrinkage after high-temperature pressing

[0007] When PET material is used, (1) due to the high melting point of PET material and the corresponding high softening point, the effect of blocking glue is poor. If the amount of glue is too large, the gold plating will be poor during gold plating; (2) The bonding force between PET and paper layer is not good; (3) The bonding force between PET and release agent is not good, which will easily cause the transfer of release agent and transfer to the line The board will also cause poor gold plating, and affect the process behind the circuit board, resulting in insufficient peel strength when pasting the reinforcement board

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