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Heat-insulating plate and manufacturing method thereof

A heat insulation board and heat insulation layer technology, which is applied to chemical instruments and methods, heat insulation protection pipelines, heat exchange equipment, etc., can solve problems such as poor heat insulation effect and thick heat insulation boards

Inactive Publication Date: 2010-06-23
PANGANG GROUP RESEARCH INSTITUTE CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the existing problems that the heat insulation board is too heavy and the heat insulation effect is not good, the invention provides a heat insulation board

Method used

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  • Heat-insulating plate and manufacturing method thereof
  • Heat-insulating plate and manufacturing method thereof
  • Heat-insulating plate and manufacturing method thereof

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Embodiment Construction

[0011] A thermal insulation panel according to the invention comprises a plurality of metal layers, such as figure 1 and figure 2 The shown thermal insulation panel of an embodiment of the invention comprises two metal layers, specifically, the thermal insulation panel comprises a first metal layer 10, a thermal insulation layer 20 and a second metal layer 30, the thermal insulation layer 20 having A plurality of hollow heat insulation units 21 , the heat insulation layer 20 is disposed between the first metal layer 10 and the second metal layer 30 .

[0012] The first metal layer 10 and the second metal layer 30 can be made of steel plate, copper plate, aluminum plate, titanium plate or alloy plate, the first metal layer 10 and the second metal layer 30 can be made of a kind of metal plate, also can be Different metal plates. According to different heat insulation requirements, the first metal layer 10 and the second metal layer 30 can choose metal plates with a thickness ...

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Abstract

The invention relates to a heat-insulating plate which comprises a plurality of metal layers and a plurality of heat-insulating layers, wherein the heat-insulating layers are arranged among the metal layers; and the heat-insulating layers comprise a plurality of heat-insulating units with hollow structures. The heat-insulating plate has good heat-insulating property and is particularly suitable for the metallurgical industry. A heat-insulating material is filled in the heat-insulating units and can further improve the heat-insulating property. The invention also provides a manufacturing method of the heat-insulating plate, which comprises the following steps: forming the heat-insulating layers with a plurality of heat-insulating units; and fixedly connecting the metal layers respectively at the upper side and the lower side of the heat-insulating layers. The strength of the heat-insulating plate can be further improved by fixedly connecting the heat-insulating layers with at least oneof the metal layers by explosive welding.

Description

technical field [0001] The invention relates to a heat shield and a manufacturing method thereof, in particular to a heat shield used under high temperature conditions in the metallurgical industry and a manufacturing method thereof. Background technique [0002] Insulation boards, especially those used in high temperature conditions in the metallurgical industry, such as stovetops, etc., in order to achieve a good heat insulation effect, the heat insulation boards are usually very thick, which is not conducive to installation and use, and wastes materials. In addition, in the prior art, heat insulating materials such as plastics are usually used as the core layer, and are arranged between the metal layers by bonding or other means to form the whole heat insulating board. The heat insulation effect of this heat insulation board is not good, and the strength of bonding and fixing is not high, and the connection method is unreliable. Contents of the invention [0003] In or...

Claims

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Application Information

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IPC IPC(8): F16L59/06F16L59/02B32B3/10B32B7/08B32B15/01
Inventor 何藩林剑东余腾义何为唐建伟
Owner PANGANG GROUP RESEARCH INSTITUTE CO LTD
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