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High-temperature and high-pressure sealing device for small optical fiber sensor test

An optical fiber sensor, high temperature and high pressure technology, applied in the field of sensor testing, can solve the problems of repeated sealing of sensors, inconvenient operation, sensor damage, etc., and achieve the effects of simple structure, improved safety, and avoiding accidental damage

Inactive Publication Date: 2010-06-30
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The sensor and the hollow tube need to be sealed, which may cause damage to the sensor;
[0012] When replacing the sensor, it needs to be sealed repeatedly, which makes the operation inconvenient;
[0013] There are certain safety hazards in the high temperature and high temperature pressure relief of the autoclave

Method used

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  • High-temperature and high-pressure sealing device for small optical fiber sensor test
  • High-temperature and high-pressure sealing device for small optical fiber sensor test
  • High-temperature and high-pressure sealing device for small optical fiber sensor test

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Experimental program
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Embodiment Construction

[0038] Such as Figure 1-Figure 3 As shown, the present invention provides a kind of high temperature and high pressure sealing device that is used for small-scale optical fiber sensor experiment, comprises:

[0039] A high-pressure tank 10, which is cylindrical or rectangular, has a circular hole 11 on the side wall of the high-pressure tank 10, and has an optical fiber sensor 50 inside the high-pressure tank 10;

[0040] A sealing cover 20, sealing the high-pressure tank 10, has a screw hole 21 in the center of the sealing cover 20; at least one optical fiber sensor holder 23 is installed on the inner wall of the sealing cover 20, which is used to fix the optical fiber sensor 50 in the sealing tank position in 10;

[0041] A bolt 30, the bolt 30 cooperates with the screw hole 21 on the sealing cover 20, and the longitudinal center of the bolt 30 has a through hole 31; a capillary 40 is further installed in the through hole 31 of the bolt 30 to enhance the sealing effect; T...

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PUM

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Abstract

The invention provides a high-temperature and high-pressure sealing device for small optical fiber sensor test. The sealing device is characterized in that the sealing device comprises a cylindrical or rectangular high-pressure tank, a sealing cover, a bolt, a bolt and a thermotank; the side wall of the high-pressure tank is provided with a circular hole, and an optical fiber sensor is arranged in the high-pressure tank; the sealing cover covers the high-pressure tank, and the center of the sealing cover is provided with a screw hole; the bolt is matched with the screw hole on the sealing cover, and the longitudinal center of the bolt is provided with a through hole; the pressure pump is connected with the circular hole on the side wall of the high-pressure tank through a pipeline; and the high-pressure tank is arranged in the thermotank.

Description

technical field [0001] The invention relates to the field of sensor testing, in particular to a high-temperature and high-pressure experimental device for small sensors. Background technique [0002] Special small sensors, especially fiber-optic temperature and pressure sensors with high temperature and high pressure characteristics, can be widely used in national defense, security monitoring, oil exploration and other fields, so they have attracted more and more attention from relevant companies and research institutions. [0003] However, for a long time, in the field of small sensor experiments and research, there has been no experimental device that can safely and conveniently perform repeated high temperature and high pressure sealing on small sensors. [0004] At present, the commonly used methods of applying temperature and pressure to the sensor are: heating the sensor through a water bath, putting the sensor in oil for high-temperature experiments; pressurizing the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K15/00G01L27/00
Inventor 张发祥张文涛李学成李芳刘育梁
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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