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Resin adhesive vacuum encapsulation device and process thereof

A resin glue and vacuum technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to achieve the effect of convenient potting operation, ensuring packaging quality, and reasonable design

Inactive Publication Date: 2010-06-30
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Their common features are: the test circuit is in a harsh environment such as high temperature, low temperature, high pressure, strong shock and vibration, so the tester is required to be precise, small and highly reliable, so the test circuit must be potted

Method used

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  • Resin adhesive vacuum encapsulation device and process thereof
  • Resin adhesive vacuum encapsulation device and process thereof
  • Resin adhesive vacuum encapsulation device and process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1. Resin glue vacuum potting device There are four small cases in total

[0025] Example 1. The specific structure of the resin glue vacuum potting device of this example is as follows: figure 1 , figure 2 Jointly shown, figure 1 A structural diagram of the resin glue vacuum potting device is shown. The potting device includes a vacuum drying box 3, a vacuum pump 1, cup and tube utensils, connecting pipes, valves and the like. Described vacuum oven 3 is purchased in the market, and its model, specification, size are selected according to needs, need to be transformed before use. Set the pump interface 2 on the vacuum drying box 3 and connect the vacuum pump 1, set or install the partition 4 in the vacuum drying box 3, set or place the overflow glue cup 5, the circuit barrel 9, and place the potting on the partition 4 in sequence For the sealing cylinder 10 of the rubber cup, use the rubber inlet tube 11 and the suction tube 12 to connect the potting rubb...

Embodiment 2

[0029] Embodiment 2. Resin glue vacuum potting process There are five small examples

example 1

[0030] Example 1. The resin glue vacuum potting process of this example

[0031] The resin glue vacuum encapsulation process of this example consists of image 3 show, image 3 The specific process steps shown include: 26 preparing vacuum potting glue, assembling or establishing a resin glue vacuum potting device or selecting a vacuum potting device for standby, taking potting glue liquid and pouring it into the potting glue cup in the sealing cylinder Adding and sealing the glue back cover the sealing tube cover, 27 to seal the sealing tube, take the circuit to be potted and put it into the circuit tube, put the circuit tube that needs to be potted into the resin glue vacuum potting device, 28 Connect all parts of the resin glue vacuum potting device, 29 control the potting device to vacuumize, 30 reach the vacuum standard and maintain the set time, observe that the potting glue basically has no volatile bubbles, 31 implement the resin glue vacuum potting circuit process and...

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Abstract

The invention relates to a resin adhesive vacuum encapsulation device and a process thereof, which belong to the resin adhesive vacuum encapsulation technical field. The encapsulation device comprises a vacuum drying box, a vacuum pump, a sealing tube, a circuit tube, an overflow adhesive cup, connecting pipelines and valves and the like, which wholly form a complete set of differential-pressure vacuum encapsulation system with encapsulating adhesive automatic flowing for vacuum pumping and atmospheric pressure pushing. The differential-pressure encapsulation device has reasonable design and simple and practical structure, and is worth applying and promoting. The encapsulation process includes the following steps of preparing vacuum encapsulation adhesive, assembling the encapsulation device, operating a valve system of the device for a vacuum-pumping process, encapsulating a circuit, and finishing the encapsulation process. The encapsulation process is adopted to form a differential-pressure encapsulation circuit process with automatic flowing of resin adhesive, the encapsulation device is adopted, the resin adhesive is improved, and the whole structure of the circuit is enhanced, and the impact resistance and the vibration resistance and other harsh environment resistance and the insulation performance for the electronic device and components are increased. The encapsulation process of the invention is applied to engineering test under various harsh environments and complex conditions, and has good practical effect.

Description

1. Technical field [0001] The resin glue vacuum potting device and potting process disclosed by the invention belong to the technical field of resin glue vacuum potting, and the invention specifically relates to a potting device and a potting process for encapsulating a test circuit in a high overload environment using resin glue The technical content can also be used for potting and using resin glue for other utensils. 2. Background technology [0002] In engineering testing, storage testing techniques are usually used for harsh testing environments and small testing spaces. Their common features are: the test circuit is in harsh environments such as high temperature, low temperature, high pressure, strong shock and vibration, so the tester is required to be precise, small and highly reliable, so the test circuit must be potted. Potting can improve the ability of electronic devices and components to resist shock and vibration, the ability to resist harsh environments and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56
Inventor 谢占魁祖静裴东兴谢锐张瑜马铁华范锦彪李新娥张红艳
Owner ZHONGBEI UNIV
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