L-shaped upstream side flowing spout

A spout and L-shaped technology, which is applied in the field of L-shaped spout with ribs, can solve the problems of low work efficiency, unsuitable for large-scale batch processing, easy to form false welding of joints, etc., so as to ensure the sufficiency and firmness sexual effect

Inactive Publication Date: 2010-06-30
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • L-shaped upstream side flowing spout
  • L-shaped upstream side flowing spout
  • L-shaped upstream side flowing spout

Examples

Experimental program
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Embodiment Construction

[0012] like figure 1 An L-shaped upstream spout with ribs is shown, which is composed of two spouts to form an L-shaped structure. A tin overflow port 1 is provided on the edge of the spout, and a rib is provided in front of the overflow spout 1. 2. The side wall of the spout at the lower end of the rib 2 is fixedly connected. The tin overflow opening 1 is a rectangular opening with a depth of 3-6 mm.

[0013] like figure 2 As shown, on the PCBA board 4 around the spout, electronic components 3 are distributed, and the edge of the spout where the electronic components on the periphery of the spout are selected to be relatively far away from the spout position is provided with a tin overflow port 1, and the spout 1 is made. The peripheral electronic components 3 are located outside the rib 2. When the tin liquid overflows from the tin overflow port 1, the rib 2 is used to limit the outward diffusion path of the tin liquid, and the peripheral electronic components 3 are solde...

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Abstract

The present invention relates to a tin furnace component for the tin soldering of PCBA plates, in particular to an L-shaped upstream side flowing spout. Two spouts are split into an L-shaped structure. A tin overflow port is arranged at the edge port of the L-shaped upstream side flowing spout. A stopping edge is arranged at the front side of the tin overflow port, and spout side walls at the lower end of the stopping edge are fixedly connected. The tin overflow port is a rectangular breach, and the depth is three to six mm. The structure of the present invention is simple, and the welding rate can be effectively improved. The tin furnace component for the tin soldering of PCBA plates is suitable for large-scale automation production. In addition, oxide layers on tin liquid surface layers are avoided to remain on the surfaces of the PCBA plates, and the quality of welding joints is ensured.

Description

technical field [0001] The invention relates to a tin furnace component used for soldering of PCBA boards, in particular to an L-shaped upstream pot spout with ribs. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, and at t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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