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Multi-workpiece processing chamber and workpiece processing system including the same

A processing system and multi-workpiece technology, which is applied in the field of workpiece processing systems, can solve the problems of difficult cleaning and maintenance of the internal space, uneven plasma density, and different opening/closing ratios, so as to achieve easy cleaning and maintenance, and improve uniformity Effect

Active Publication Date: 2010-07-14
AFO株式会社
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AI Technical Summary

Problems solved by technology

However, the disclosed multiple workpiece processing chamber has the walls as a single body, and there arises the problem that the two workpiece processing stations and the interior space are difficult to clean and maintain
Thus, there arises a problem that the density of the generated plasma is not uniform throughout the internal processing space
[0011] However, this opening / closing member 860 has a problem that its opening / closing ratio is different for each of the internal processing spaces 830 and 840 when rotating along the rotation axis 870

Method used

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  • Multi-workpiece processing chamber and workpiece processing system including the same
  • Multi-workpiece processing chamber and workpiece processing system including the same
  • Multi-workpiece processing chamber and workpiece processing system including the same

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Embodiment Construction

[0074] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings, in which like reference numerals designate like elements and repeated descriptions will be avoided as much as possible. The exemplary embodiments of the present invention can be changed in various forms, and it should not be construed that the scope of the present invention is limited to the exemplary embodiments described in detail below. These exemplary embodiments are provided to fully explain the present invention to those skilled in the art. Accordingly, the shapes of elements in the drawings may be exaggerated to provide more precise illustration. A detailed description of certain known functions and constructions that may obscure key points of the present invention is omitted.

[0075] image 3 is a schematic diagram showing the configuration of a multiple workpiece processing system according to the present invention. A multiple workpiece...

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Abstract

A multi-workpiece processing chamber according to the present invention comprises a chamber housing which forms at least two internal processing spaces therein; at least one partition member which is provided in the chamber housing and partitions the chamber housing into at least two internal processing spaces; and the respective internal processing spaces being coupled with the partition member and having a symmetric shape to generate a processing reaction uniformly. The multi-workpiece processing chamber according to the present invention has internal processing spaces that have a symmetric shape by being coupled with a partition member. Thus, a processing reaction uniformly occurs across the internal processing areas and reproducibility and uniformity of a workpiece processing process may improve.

Description

technical field [0001] Apparatus and methods consistent with the present invention relate to a multiple workpiece chamber and a workpiece processing system including the same, and more particularly, to a multiple workpiece processing chamber having a plurality of internal processing spaces and including the multiple workpiece processing chamber workpiece handling system. Background technique [0002] In recent years, workpiece processing systems for manufacturing liquid crystal display (LCD) devices, plasma display panels (PDP), and semiconductor devices employ cluster systems to simultaneously process a plurality of workpieces. The cluster system refers to a multi-chamber workpiece processing system, which includes a transfer robot (or loader) and a plurality of workpiece processing modules arranged around the robot. Generally, the cluster system includes a transfer chamber and a transfer manipulator arranged to rotate freely in the transfer chamber. A workpiece processin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02H01L21/205H01L21/3065
CPCH01L21/6719
Inventor 魏淳任南昌佑
Owner AFO株式会社
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