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Jig and device for dispensing encapsulation of LED module

A technology of LED modules and equipment, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of high colloid cost, high cost, and a large amount of colloid, and achieve the effect of saving colloid and reducing packaging cost

Inactive Publication Date: 2012-09-05
SHENZHEN GENTA LED COMPONENTS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using the glue-filling LED module packaging method requires a large amount of colloid to fasten and seal the LED module components, and the cost is high. Especially for white LED lamp products for lighting purposes, the colloid needs to be added with expensive fluorescent light. Powder material, which greatly increases the cost of the colloid, thereby greatly increasing the packaging cost of the LED module

Method used

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  • Jig and device for dispensing encapsulation of LED module
  • Jig and device for dispensing encapsulation of LED module
  • Jig and device for dispensing encapsulation of LED module

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Embodiment Construction

[0016] Such as figure 1 As shown, the embodiment of the present invention provides a device for LED module dispensing and packaging, which includes a first pneumatic power device 1, a second pneumatic power device 2, and a hot press connected to the second pneumatic power device 2. Die 3, and the jig 4 of the embodiment of the present invention arranged between the first pneumatic power device 1 and the second pneumatic power device 2, the jig 4 is used to cooperate with the first pneumatic power device 1 to be placed in the jig 4 The LED module components are locked, and the LED module components generally include such as figure 2 Shown plastic mask 5 and circuit board 6, and one side of plastic mask 5 is provided with rivet-like plastic cylinder 7, and it passes through the opening 8 on the circuit board 6, and the size of the opening 8 of general circuit board 6 and rivet-like plastic Cylinder 7 is matched, in order to be beneficial to finish follow-up hot pressure riveti...

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Abstract

The embodiment of the invention relates to a jig for dispensing encapsulation of an LED module. The jig comprises a pressing plate and a base, wherein the base is movably connected with the pressing plate. A plurality of perforated holes are arranged on the base and are used to be matched with a hot pressing die to conduct hot pressing and riveting to the components of the LED module. The embodiment of the invention additionally provides a device for dispensing encapsulation of the LED module. By adopting the jig and the device of the embodiment of the invention, the hot pressing and rivetingcan be conducted to the components of the LED module encapsulated by using the dispensing method, the components of the LED module are closely sealed to form a whole body after being cooled, the requirements of the dispensing encapsulation technology are satisfied, the sealant pouring type LED module encapsulation method is not required to be adopted, a great amount of sealant is saved and the cost of LED module encapsulation is greatly reduced.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a fixture for dispensing and encapsulating LED modules and equipment for dispensing and encapsulating LED modules. Background technique [0002] At present, LED integrated packaging modules are more and more widely used in various display information boards or display screens, and its advantages are simple production process and high efficiency. However, using the glue-filling LED module packaging method requires a large amount of colloid to fasten and seal the LED module components, and the cost is high. Especially for white LED lamp products for lighting purposes, the colloid needs to be added with expensive fluorescent light. powder material, which greatly increases the cost of the colloid, thereby greatly increasing the packaging cost of the LED module. Contents of the invention [0003] The technical problem to be solved by the embodiments of the present invention is to provide a jig ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48
Inventor 黄少忠
Owner SHENZHEN GENTA LED COMPONENTS