Jig and device for dispensing encapsulation of LED module
A technology of LED modules and equipment, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of high colloid cost, high cost, and a large amount of colloid, and achieve the effect of saving colloid and reducing packaging cost
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[0016] Such as figure 1 As shown, the embodiment of the present invention provides a device for LED module dispensing and packaging, which includes a first pneumatic power device 1, a second pneumatic power device 2, and a hot press connected to the second pneumatic power device 2. Die 3, and the jig 4 of the embodiment of the present invention arranged between the first pneumatic power device 1 and the second pneumatic power device 2, the jig 4 is used to cooperate with the first pneumatic power device 1 to be placed in the jig 4 The LED module components are locked, and the LED module components generally include such as figure 2 Shown plastic mask 5 and circuit board 6, and one side of plastic mask 5 is provided with rivet-like plastic cylinder 7, and it passes through the opening 8 on the circuit board 6, and the size of the opening 8 of general circuit board 6 and rivet-like plastic Cylinder 7 is matched, in order to be beneficial to finish follow-up hot pressure riveti...
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