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Supplier for electronic components

A supply device and electronic component technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of reducing production line productivity, prolonging production time and personnel needs, and achieving the effect of reducing downtime, reducing failure rate, and improving component throughput

Inactive Publication Date: 2014-11-05
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The manual execution of the process, in particular in high-speed assembly machines, therefore has the disadvantage that production times are thus prolonged and increased personnel requirements are required for the assembly process.
Even when the process is carried out manually (e.g. inserting conveyor rollers, splicing, etc.) with great care, failures cannot be completely avoided, resulting in possible downtimes, which can additionally reduce the productivity of the production line

Method used

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  • Supplier for electronic components

Examples

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Embodiment Construction

[0020] in figure 1 Exemplarily and schematically shows the structure of the supply device ZE for electronic components according to the present invention. With the aid of the supply device ZE, the components are delivered to the pick-up position AB and made available there for the assembly process. In order to make the component conveyor belt continue to move in the feeding direction such as the feeding device ZE, a so-called transfer-or pin wheel TR is usually provided, and the transfer-or pin wheel engages in the so-called transfer hole of the component conveyor belt so that it is It moves in the conveying direction and thus brings the component to the pickup position AB.

[0021] In SMD-automatic assembly machines, components are usually placed in pocket-shaped recesses of component conveyor belts. In order to avoid falling off, the component conveyor belt is closed with a cover film, which must be removed before assembly or before reaching the pickup position. To this end,...

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PUM

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Abstract

-NOVELTY : The supply device (ZE) feeds electronic parts retained by a cover film in pocket-like recesses of a component tape having at least one perforation parallel to its edges. At least one roller bracket (RT1) is provided for receiving a component tape placed on the tape roller (GR1), the tape being received and driven by a transport device (E1). A separating device (TE) separates the cover film from the component tape to expose the electronic components. Preferably the separating device (TE) has a guide rail (FS) and a slip drive (TW) which may comprise a pair of spaced-apart rollers. -USE : As a supplying device for feeding electronic components, especially surface-mounted devices in tape-and-reel form, in an automatic assembly machine mounting components onto the surface of a substrate or printed circuit board. -ADVANTAGE : The supplying device can simply and rapidly separate the cover film from the component tape and can automatically feed from a second adjacent tape when sensors indicate that the first component supply is exhausted, so that the number of components supplied during an assembly process can be increased. The failure rate and costs of using the supplying device are lowered due to the need for manual operations such as splicing component tapes being avoided.

Description

Technical field [0001] The invention relates to a supply device for electronic components, in particular for so-called SMD-automatic assembly machines. The electronic component is placed in a pocket-like recess of a component conveyor belt (Bauelementegurte) and covered by a cover film, wherein the component conveyor belt (as described in the unpublished German application document 102008049479.8) has at least one approximately parallel to Perforations on the edges of the conveyor belt. Background technique [0002] In assembly technology, especially in so-called surface mount technology (SMT), electronic components are mounted on the surface of a substrate or printed circuit board by an automatic assembly machine, a so-called SMD (Surface Mount Device)-automatic assembly machine. The components for the assembly process are provided at the pick-up position by means of so-called feeding devices, which are installed in an automatic assembly machine, for example, on the side of a t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02
CPCH05K13/0417H05K13/0419
Inventor 斯文·霍尔格·斯特雷夫
Owner ASM ASSEMBLY SYST GMBH & CO