Epoxy resin composition
A technology of epoxy resin and solid epoxy resin, applied in the field of epoxy resin composition for LED sealing
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preparation example Construction
[0016] There is no particular limitation on the preparation method of the solid epoxy resin (A), and a known and commonly used method is applicable. As a representative preparation method, with respect to 1 equivalent of the epoxy group of epoxy resin (a), make polyester compound (b) with the ratio of 0.2~0.9 equivalent of its carboxyl group, preferably 0.3~0.6 equivalent, in the presence of catalyst, It can be obtained by reacting at 120-180°C. When the proportion of the carboxyl group is less than 0.2 equivalent, the softening point is low, and the blocking resistance is deteriorated; when it is greater than 0.9, the melt viscosity is high, and the handleability at the time of curing is deteriorated.
[0017] The solid epoxy resin (A) thus obtained has an epoxy equivalent of 300 to 1000 g / eq and a softening temperature of 60 to 120° C., preferably an epoxy equivalent of 400 to 900 g / eq. When the epoxy equivalent is less than 300 g / eq, the crosslinking density of the cured p...
Embodiment
[0024] Hereinafter, with respect to the present invention, Synthetic Examples, Examples, and Comparative Examples are given to further specifically describe the present invention.
Synthetic example 1
[0026]215 parts of リカシッッド MH (methylhexahydrophthalic anhydride; manufactured by Shin Nippon Chemical Co., Ltd.) and 215 parts of リカビノール HB ( Hydrogenated BPA; Nippon Chemical Co., Ltd.) 192 parts of the mixture was reacted at 150° C. for 2 hours to obtain a carboxyl-terminated polyester compound having a carboxyl group number of 1.6 per molecule, a carboxyl equivalent weight of 320 g / eq, and a solid at room temperature. Then, 507 parts of YDC-1312 (glycidyl ether of 2,5-di-tert-butyl-1,4-phenylene bis; manufactured by Tohto Kasei, epoxy equivalent 178g / eq, melting point 142°C) and phosphoric acid tris 0.2 parts by weight of phenyl ester were stirred and mixed at 150° C. for 4 hours to obtain solid epoxy resin c-1 having a softening point of 94° C., an epoxy equivalent of 580 g / eq, and an aromatic ring content of 13.8%.
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Abstract
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