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Epoxy resin composition

A technology of epoxy resin and solid epoxy resin, applied in the field of epoxy resin composition for LED sealing

Active Publication Date: 2010-07-28
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to improve long-term environmental reliability, crack resistance during thermal cycling is required. In order to meet these required performances, there is a trade-off relationship between high Tg and low elastic modulus in the rubber field, and it is required to balance both. Conventional Technical solid transparent epoxy resins do not adequately meet these performance requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0016] There is no particular limitation on the preparation method of the solid epoxy resin (A), and a known and commonly used method is applicable. As a representative preparation method, with respect to 1 equivalent of the epoxy group of epoxy resin (a), make polyester compound (b) with the ratio of 0.2~0.9 equivalent of its carboxyl group, preferably 0.3~0.6 equivalent, in the presence of catalyst, It can be obtained by reacting at 120-180°C. When the proportion of the carboxyl group is less than 0.2 equivalent, the softening point is low, and the blocking resistance is deteriorated; when it is greater than 0.9, the melt viscosity is high, and the handleability at the time of curing is deteriorated.

[0017] The solid epoxy resin (A) thus obtained has an epoxy equivalent of 300 to 1000 g / eq and a softening temperature of 60 to 120° C., preferably an epoxy equivalent of 400 to 900 g / eq. When the epoxy equivalent is less than 300 g / eq, the crosslinking density of the cured p...

Embodiment

[0024] Hereinafter, with respect to the present invention, Synthetic Examples, Examples, and Comparative Examples are given to further specifically describe the present invention.

Synthetic example 1

[0026]215 parts of リカシッッド MH (methylhexahydrophthalic anhydride; manufactured by Shin Nippon Chemical Co., Ltd.) and 215 parts of リカビノール HB ( Hydrogenated BPA; Nippon Chemical Co., Ltd.) 192 parts of the mixture was reacted at 150° C. for 2 hours to obtain a carboxyl-terminated polyester compound having a carboxyl group number of 1.6 per molecule, a carboxyl equivalent weight of 320 g / eq, and a solid at room temperature. Then, 507 parts of YDC-1312 (glycidyl ether of 2,5-di-tert-butyl-1,4-phenylene bis; manufactured by Tohto Kasei, epoxy equivalent 178g / eq, melting point 142°C) and phosphoric acid tris 0.2 parts by weight of phenyl ester were stirred and mixed at 150° C. for 4 hours to obtain solid epoxy resin c-1 having a softening point of 94° C., an epoxy equivalent of 580 g / eq, and an aromatic ring content of 13.8%.

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PUM

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Abstract

Disclosed is an epoxy resin composition characterized by containing a solid epoxy resin (A) having an aromatic ring content of 5-40%, which is obtained by reacting a bifunctional epoxy resin (a) having an epoxy equivalent weight of 120-350 g / eq with a polyester compound (b) having 1.2-1.8 carboxyl groups per one molecule, and a curing agent (B). A cured product obtained by curing such a composition is excellent in heat resistance, moisture resistance and crack resistance, and thus it is useful in the field of electronic materials such as optical semiconductor sealing materials, in particular LED sealing materials.

Description

technical field [0001] The present invention relates to excellent moisture resistance, heat resistance, crack resistance, and transparency, and is useful in coating resins, coating agents, printing inks, resist inks, adhesives, semiconductor sealing materials, molding materials, and casting molds. An epoxy resin composition useful in the field of materials and electrical insulating materials, particularly an epoxy resin composition suitable for sealing light-emitting diodes (hereinafter referred to as LEDs). Background technique [0002] Epoxy resins are mainly used for various purposes in the fields of paint, civil engineering, and electricity due to their excellent electrical properties, adhesiveness, heat resistance, and the like. In particular, aromatic epoxy resins such as diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, novolak epoxy resin, and cresol novolac epoxy resin have excellent water resistance, adhesion, and mechanical properties. It is widel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C08G59/20
CPCC08G59/066C08G59/42C08G59/186C08L63/00
Inventor 吉田一彦军司雅男宅和成刚
Owner NIPPON STEEL CHEM &MATERIAL CO LTD