Laser processing head

A laser processing head and laser processing technology, used in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve problems such as increased processing costs and high cost constraints, to reduce overall costs, achieve miniaturization, and achieve high density. integrated effects

Active Publication Date: 2010-08-18
宁波晶钻科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Precision structures are machined on closed inner surfaces, which inevitably increases machining costs
[0006] In addition, the high cost of the rotary assembly structure restricts the high-density integration of complex functions

Method used

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  • Laser processing head
  • Laser processing head
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Experimental program
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Embodiment Construction

[0033] The present invention will be described in further detail below in conjunction with specific embodiments.

[0034] like figure 1 , figure 2 As shown, the main board is assembled and connected to the packaging board. The laser processing head in the present invention simplifies numerous cylindrical parts into a three-dimensional structure in which the board unit is superimposed. The board unit mainly includes the main board 2 and the packaging board 4, and the main board 2 and the packaging board 4 Assembly connections. The main board 2 is a flat plate made of high thermal conductivity materials such as copper and aluminum. The top of the main board 2 is connected to the CCD 1 , and the bottom is connected to the nozzle 3 . A cavity required for the nozzle 3 is formed between the main board 2 and the packaging board 4 , and the upper part of the nozzle 3 is accommodated in the cavity. There are mounting holes 6 on the main board 2 . A series of optical structures ar...

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Abstract

The invention relates to a laser processing head, which comprises a processing head matrix and laser processing function units arranged on the matrix. The processing head matrix is formed by assembling at least two plate units obtained by open processing, and the laser processing function units are integrated on the plate units. The matrix of the laser processing head is assembled by the plate units obtained by the open processing, and the laser processing function units are integrated on the matrix, so high-intensity integration of the laser processing function is realized, the cost is reduced, and miniaturization and microminiaturization are realized.

Description

technical field [0001] The invention belongs to the field of laser processing, in particular to a laser processing head. Background technique [0002] Laser processing is an increasingly widely used non-contact processing method. Usually, the low-intensity parallel laser energy can be focused through the optical system to form a high-intensity energy field with a small diameter, which acts on the workpiece, heats, melts, or directly sublimates the workpiece to achieve the processing purpose of deformation, hardening, welding, cutting or scribing . A complete laser processing system includes laser, optical path transmission unit, laser processing head, motion and control system, workpiece, and auxiliary systems (such as auxiliary processing gas, etc.). [0003] Although laser processing has many advantages, compared with other systems, such as mechanical processing systems, this type of system is more expensive and complicated to operate. The laser processing head is a ver...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/42B23K26/70
Inventor 张文武张军安
Owner 宁波晶钻科技股份有限公司
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