5results about How to "Achieve high-density integration" patented technology

The utility model provides a kind of element embedded circuit board and circuit board assembly, and it includes board body and the embedded element group of being arranged in board body, external element;The embedded element group includes shell part and is arranged in the adhesive layer, filling layer, embedded element of shell part, the adhesive layer is arranged between embedded element or between embedded element and shell part, and the filling layer is filled in shell part;The embedded element of this embedded element group is more than one;The shell part is heat-conducting metal material, and heat-conducting connection between adjacent shell part.The circuit board of the utility model can consider heat dissipation performance and miniaturization design, with good development prospect;Strong practicality.

The invention relates to an optical detection device, which is used for detecting a to-be-detected object placed at a test station, and comprises a first coaxial light source which comprises a first light-emitting part and a first light splitting part; the first light-emitting part is used for emitting a first illumination light beam towards a first side surface of a to-be-detected object along a first direction; the first light splitting part is arranged in a light emitting path of the first light emitting part; the first high-brightness light source is arranged on one side of the first coaxial light source and used for emitting a first light supplementing beam, and the first light supplementing beam is projected to the second side face of the to-be-measured object in the direction opposite to the first direction; the light path turning unit and the first light splitting part are arranged in a spaced mode in the second direction, and the second direction and the first direction intersect and are not coplanar. The imaging unit is arranged on one side of the first coaxial light source; the optical detection device provided by the invention is high in detection sensitivity, reduces the risk of missing report and false report, and improves the accuracy and reliability of detection.

The present application relates to the technical field of haptic and proximity sensation fusion detection devices, and particularly relates to a neuro-mimetic haptic and proximity sensation fusion receptor and a signal processing method thereof. The receptor comprises a multi-modal perception array layer and a neuro-mimetic processing array layer. The multi-modal perception array layer comprises a haptic sensing array layer formed by a plurality of haptic sensing unit arrays and a proximity sensing array layer formed by a plurality of proximity sensing unit arrays. The neuro-mimetic processing array layer comprises a plurality of array-arranged memristor units. Each memristor unit is electrically connected with at least one haptic sensing unit and at least one proximity sensing unit. The corresponding disclosed signal processing method is used. The fusion receptor uses multi-modal receptors and memristors to simulate biological neural circuits. The memristor array is used as a front-end processing unit to perform pulse coding, space-time fusion and feature extraction on the sensing signals of the haptic sensing unit and the proximity sensing unit.

This application discloses a magnet power supply controller, method, and system, relating to the field of power control technology. Specifically, it includes: a baseboard and a core board connected to the baseboard via an inter-board connector; the baseboard includes an interface unit, and the core board includes a processing module; the interface unit acquires feedback signals from the magnet power supply and transmits them to the processing module via the inter-board connector; the processing module generates control signals based on the feedback signals and outputs them to the magnet power supply via the inter-board connector and the interface unit. This application solves the problems of large size, low integration, and large cross-board signal transmission delay in existing discrete controllers through the integrated compact architecture of the baseboard and core board and the high-speed data transmission of the inter-board connector, significantly improving system integration and reducing communication delay between acquisition and control.