Optical fiber assembly applied to silicon photonic optical communication

Abstract

The invention provides an optical fiber assembly applied to silicon photonic optical communication. The optical fiber assembly comprises an optical fiber array unit and a core inserting assembly. Theoptical fiber array unit comprises a coupling end surface, a glass cover plate, a glass substrate, a small-mode-field optical fiber and a normal-scale-field optical fiber. The small-mode-field opticalfiber is connected with the normal-scale-field optical fiber in a welding mode. The small-mode-field optical fiber is fixed between the glass cover plate and the glass substrate, and the end surfaceof the small-mode-field optical fiber is polished to form the coupling end surface of the optical fiber array unit. The normal-scale-field optical fiber at the other end of the optical fiber array unit is assembled into the core inserting assembly. According to the invention, the optical fiber assembly is low in manufacturing cost. Through the fusion welding of optical fibers of different mode-field diameters, the small-mode-field optical fiber can be directly connected with a silicon optical chip. Since no lens is required, the assembling difficulty is reduced. Meanwhile, the optical fiber assembly is high in assembling efficiency and small in size. The transmission performance of optical signals can be ensured.

Description

technical field [0001] The invention relates to silicon photonic optical communication, in particular to input and output optical fiber components of silicon photonic devices. Background technique [0002] Silicon photonics technology, which uses laser beams instead of electronic signals to transmit data, combines optical and electronic components into a single microchip to speed up chip-to-chip connections between routers and switch line cards. Using light as an information transmission medium on a silicon chip can achieve better data transmission performance than traditional copper wires and reduce energy consumption. Optical fiber components are key components for data input and output of silicon photonic devices, and the innovation of their technical solutions is the key to breaking through the bottleneck of silicon photonic device production. With the deployment of data centers and mobile 4G and 5G networks, increasingly stringent requirements are placed on the transmi...

AI Technical Summary

Problems solved by technology

However, since the mode field diameter of the silicon photonic chip is only 3.0-4.0um or smaller, while the mode field diameter of the conventional optical fiber component is 9-10um, in order to reduce the coupling loss and meet the transmission requirements, the current process is to combine the silicon photonic chip and The fiber optic components are coupled through lens focusing ( image 3 ), this process cannot really meet the requirements of low manufacturing cost and high-density integration of silicon photonic devices

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