Circuit board structure, electronic product, and preparation method and maintenance method of circuit board structure

A technology for circuit boards and electronic components, which is applied in the structural connection of printed circuits, printed circuit manufacturing, printed circuits, etc. Convenience and the effect of reducing the board area

Pending Publication Date: 2021-05-25
SZ DJI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, the maintenance of electronic components such as chips is not easy, and the maintenance yield is low

Method used

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  • Circuit board structure, electronic product, and preparation method and maintenance method of circuit board structure
  • Circuit board structure, electronic product, and preparation method and maintenance method of circuit board structure
  • Circuit board structure, electronic product, and preparation method and maintenance method of circuit board structure

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Embodiment Construction

[0060] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0061] It should also be understood that the terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural referents unless the context clearly dictates otherwise.

[0062] It should also be further understood that the term "and / or" used in ...

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Abstract

A circuit board structure (10), an electronic product, and a preparation method and a maintenance method of the circuit board structure (10) are provided. At least two substrates of the circuit board structure (10) are stacked, and each substrate is provided with an electronic component (13); the at least two substrates are stacked at intervals through a connecting structures (11); before at least one electronic component (13) is soldered to a substrate, a solder body (12) having a connecting solder ball (121) and a solder paste layer (122) is provided in the electronic component (13).

Description

technical field [0001] The present application relates to the technical field of circuit boards, in particular to a circuit board structure, an electronic product, a preparation method and a maintenance method of the circuit board structure. Background technique [0002] With the development trend of miniaturization of electronic products, more and more high-density substrates and stacked substrates have emerged, and electronic components such as chips, diodes, and capacitors are soldered on the substrates. Poor assembly or damage of various electronic components is inevitable during the manufacture and use of products. However, as the number of electronic components increases, there is less and less space left on the substrate and less space for repairs. As a result, the maintenance of electronic components such as chips is not easy, and the maintenance yield is low. Contents of the invention [0003] Based on this, the present application provides a circuit board struc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K1/18H05K3/34H05K3/36
CPCH05K1/144H05K1/145H05K1/18H05K3/34H05K3/368H05K2201/10984
Inventor 申中国胡正高张飞
Owner SZ DJI TECH CO LTD
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