Micro rectangular multi-core connector with air-tight seal and manufacturing method thereof

An airtight, micro-rectangular technology, applied in the direction of connection, parts of the connection device, electrical components, etc., can solve the problems of product air leakage failure, high integration density, glass cracking, etc., to ensure airtightness and reliability, Good process compatibility and reduced packaging volume

Inactive Publication Date: 2020-12-11
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] (1) The micro-rectangular multi-core connector disclosed in CN 201887205 U is integrated with the box body through a welding process, and the integration density is high, but because the thermal expansion coefficient of the micro-rectangular multi-core connector is about 5ppm/°C, the thermal expansion coefficient of the aluminum alloy is about 23.5ppm /°C, the thermal mismatch between the two is serious. During the use of the connector, faults such

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  • Micro rectangular multi-core connector with air-tight seal and manufacturing method thereof
  • Micro rectangular multi-core connector with air-tight seal and manufacturing method thereof
  • Micro rectangular multi-core connector with air-tight seal and manufacturing method thereof

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[0026] The invention will be further described below with reference to the attached drawings.

[0027] such as Figure 1 、 Figure 2 and Figure 3 As shown, the present invention provides a micro-rectangular multi-core connector with airtight seal, which comprises a shell 1 and an airtight socket 2; The airtight socket includes pins 4, insulating medium 5 and adapter plate 3, the adapter plate 3 is provided with array through holes and boss structures, pins are sintered in the through holes of adapter plate 3 side by side, insulating medium 5 is filled between pins 4 and adapter plate 3 to form airtight socket, airtight socket 2 is positioned inside shell 1 through boss structure on the upper part of adapter plate 3, and is fixedly and hermetically connected with shell 1 by brazing; The difference between the thermal expansion coefficient of the dielectric and the thermal expansion coefficient of the adapter plate shall not exceed 2ppm / ℃.

[0028] The upper part of the shell of the m...

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Abstract

The invention relates to a micro rectangular multi-core connector with an air-tight seal. The micro rectangular multi-core connector comprises a shell and an air-tight seal socket, the air-tight sealsocket comprises pins, an insulating medium and an adapter plate, the adapter plate is provided with array through holes and boss structures, the pins are sintered in the through holes of the adapterplate side by side, the insulating medium is filled between the pins and the adapter plate to form the air-tight seal socket, and the air-tight seal socket is positioned in the shell through the bossstructures on the upper portion of the adapter plate and is fixedly and hermetically connected to the shell by brazing. The problem of thermal mismatch between the aluminum box body and the micro-rectangular multi-core connector is solved by selecting a material of which the thermal expansion coefficients are gradually increased and adding a thermal matching buffer structure, so that the air tightness and the reliability of electronic component packaging are ensured. The micro-rectangular multi-core connector and the aluminum box body are installed and fixed by welding, so that high-density integration of low-frequency connection is realized, and the packaging volume is reduced, the temperature resistance of the micro-rectangular connector prepared by the method is higher than 220 DEG C, and the process compatibility is good.

Description

technical field [0001] The invention relates to the field of electrical connectors, and in particular to a micro-rectangular multi-core connector capable of airtight welding on an aluminum alloy box body and a manufacturing method thereof. Background technique [0002] In order to meet the high-density, high-performance, and high-reliability application requirements of electronic equipment, the packaging of electronic components continues to develop in the direction of miniaturization, light weight, high heat dissipation, and high strength. Specifically, the use of micro-rectangular multi-core connectors improves the interconnection density and efficiency of low-frequency signals and reduces the packaging volume; the use of aluminum alloy as the packaging box material improves heat dissipation performance, reduces product weight, and ensures packaging strength. In high-reliability application scenarios such as space and underwater, the entire package is required to be airtig...

Claims

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Application Information

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IPC IPC(8): H01R13/52H01R43/00H01R43/20
CPCH01R13/5202H01R13/521H01R43/00H01R43/20
Inventor 卢茜张剑李阳阳董东景飞高阳曾元祁
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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