Micro rectangular multi-core connector with air-tight seal and manufacturing method thereof
An airtight, micro-rectangular technology, applied in the direction of connection, parts of the connection device, electrical components, etc., can solve the problems of product air leakage failure, high integration density, glass cracking, etc., to ensure airtightness and reliability, Good process compatibility and reduced packaging volume
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0026] The present invention will be further described below in conjunction with the accompanying drawings.
[0027] Such as figure 1 , figure 2 with image 3 As shown, the present invention provides a micro-rectangular multi-core connector with airtightness, including a shell 1, an airtight socket 2; the airtight socket includes a pin 4, an insulating medium 5 and an adapter plate 3, the The adapter plate 3 is provided with an array of through holes and a boss structure, and the pins are sintered side by side in the through holes of the adapter plate 3. The insulating medium 5 is filled between the pins 4 and the adapter plate 3 to form an air-tight socket. 2 The boss structure on the upper part of the adapter plate 3 is positioned inside the shell 1, and is fixed and sealed with the shell 1 by brazing; the difference between the thermal expansion coefficient of the insulating medium and the thermal expansion coefficient of the adapter plate does not exceed 2ppm / °C.
[00...
PUM
Property | Measurement | Unit |
---|---|---|
Thermal expansion coefficient | aaaaa | aaaaa |
Melting point | aaaaa | aaaaa |
Melting point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com