Organic substrate embedding and packaging structure integrating antenna and radio frequency front end

Abstract

An organic substrate embedding and packaging structure integrating an antenna and a radio frequency front end comprises: an antenna module; a radio frequency front-end module which is arranged below the antenna module and comprises a first core plate, wherein at least one through groove is arranged in the first core plate; at least one active chip, wherein the surface of one side of the active chip is an active surface, the surface of the other side of the active chip is back metal, and the active chip is buried in the through groove of the first core plate; a first dielectric layer which is arranged below the first core plate, wherein a through groove is formed in the position, corresponding to the through groove in the first core plate, of the first dielectric layer; a second core platewhich is arranged below the first dielectric layer, wherein a plurality of component bonding pads are arranged on the upper surface of the second core plate, one side of the active surface of the active chip faces downwards and is inversely arranged on the component bonding pad on the upper surface of the second core plate; a second dielectric layer which is arranged above the first core plate, wherein a plurality of metallized blind holes are formed in the second dielectric layer in a penetrating mode.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an organic substrate embedded packaging structure integrating a millimeter wave antenna and a radio frequency front end. Background technique [0002] In order to improve the integration level, the International Semiconductor Technology Development Route Organization proposed Beyond Moore's Law, aiming to integrate processors, memories, radio frequency modules, digital modules, analog modules, optoelectronic modules, sensor modules, etc. into a single package to achieve system-in-package (System in Package, SiP), if the antenna is also integrated in the system-in-package, it is called Antenna in Package (AiP). [0003] At present, the research on AiP mainly focuses on the integration of single-chip transceivers and antennas. However, the integration of multi-chip RF front-ends and antenna arrays faces the following technical problems: Most of the millimeter-wave c...

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Problems solved by technology

[0003] At present, the research on AiP mainly focuses on the integration of single-chip transceivers and antennas. However, the integration of multi-chip RF front-ends and antenna arrays faces the following technical problems: Most of the millimeter-wave chips used in RF front-ends are based on compound semiconductor technology. Surface transmission lines, inductance-capacitance air bridges, and back grounding requirements limit chip packaging to wire bonding, but as the operating frequency increases, the parasitic effects of bonding wires become more apparent; at the same time, electronic products require thinner and smaller packages. However, the light and thin packaging structure limits the thickness of the antenna substrate, thereby limiting the improvement of the antenna performance; in addition, when the antenna is integrated with the RF front-end, the gap between the active chip and the active chip, and between the antenna and the active chip The problem of electromagnetic interference is particularly serious; moreover, most of the passive components are surface-mounted on the motherboard, occupying the area of ​​the RF front-end module

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