Solder resist preparation method and structure for integrating BGA bonding pad on surface of substrate

A substrate surface and pad technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as difficult implementation

Pending Publication Date: 2021-04-20
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
  • Description
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Problems solved by technology

[0004] In view of this, the embodiment of the present invention provides a solder resist preparation method and structure for integrating BGA pads on the su

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  • Solder resist preparation method and structure for integrating BGA bonding pad on surface of substrate
  • Solder resist preparation method and structure for integrating BGA bonding pad on surface of substrate
  • Solder resist preparation method and structure for integrating BGA bonding pad on surface of substrate

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[0044] In the following description, for the purpose of illustration rather than limitation, specific details such as specific system structures and technologies are set forth in order to provide a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0045] In order to illustrate the technical solutions of the present invention, the following specific embodiments are used for description.

[0046] figure 1 A schematic diagram of an implementation flow of a method for preparing a solder mask for integrating BGA pads on a substrate surface provided by an embodiment of the present invention is described in detail as fol...

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Abstract

The invention is applicable to the technical field of bonding pad preparation, and provides a solder resist preparation method and structure for integrating a BGA bonding pad on the surface of a substrate, and the method comprises the steps: sputtering a plurality of layers of metal on a substrate to obtain a seed layer, and electroplating a gold layer on the seed layer; electroplating a composite metal structure on the gold layer to obtain a bonding pad, and etching the bonding pad to form a solder resist ring for welding solder balls to obtain a first sample; carrying out first preset temperature air annealing on the first sample,preparing an organic solder resist ring on the periphery of the pad on surface of the first sample after annealing and at position covering the solder resist ring, and carrying out baking at second preset temperature; and soldering solder balls on the pad within the range of the organic solder resist ring. The electroplated gold layer is sputtered on the substrate to serve as the conductor layer on the surface of the substrate, so that the wiring density can be improved; according to the embodiment of the invention, the bonding pad is prepared by adopting a full-addition layer-by-layer electroplating mode, the size precision is high, and the digital circuit chip is welded on the bonding pad in the radio frequency tube shell through the solder ball, so that high-density integration is realized.

Description

technical field [0001] The invention belongs to the technical field of pad preparation, and in particular relates to a solder resist preparation method and structure for integrating BGA pads on the surface of a substrate. Background technique [0002] With the continuous optimization of RF chips in terms of power, efficiency, and size, analog circuit functional modules such as power amplification, filtering, and switching can be realized by a single bare chip or by stacking several chips. In order to finally integrate the compressed volume of microwave components in a single package and realize the deviceization of microwave components, it is necessary to integrate digital circuit chips such as AD / DA, power control and digital processing into the RF package. [0003] However, compared with the analog radio frequency chip, the number of functional pins of the digital circuit chip can reach dozens, which makes it difficult to integrate the digital circuit chip into the radio f...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L23/488
CPCH01L2224/11Y02P70/50
Inventor 李仕俊袁彪常青松徐达王磊王志会张彦青郭旭光魏爱新李红梅王晓青刘晓娜吴晓楠白立娟高晓晔
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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