Galvanometer system correction device and correction method thereof

A technology of a correction device and a correction method, which is applied to welding equipment, laser welding equipment, metal processing equipment, etc., can solve the problems of low efficiency of galvanometer system correction, improve update efficiency and real-time correction calculation runtime efficiency, and suppress Accuracy drift, effect of reducing labor intensity

Inactive Publication Date: 2014-08-20
THE 45TH RES INST OF CETC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The object of the present invention is to provide a vibrating mirror system calibration device and its calibration method, aiming to solve the problem of low efficiency of the existing vibrating mirror system correction. By using the present invention, the precision drift of the vibrating mirror system can be effectively suppressed, and the accuracy of the vibrating mirror system can be improved. The efficiency of updating the correction model and the efficiency of real-time correction calculation operation can improve the degree of automation of the equipment, reduce the labor intensity of the operator, and greatly improve the processing accuracy, product quality and production efficiency of the equipment; its structure is simple, its principle and method are unique

Method used

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  • Galvanometer system correction device and correction method thereof
  • Galvanometer system correction device and correction method thereof
  • Galvanometer system correction device and correction method thereof

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Embodiment Construction

[0040] The specific embodiments described here are only used to explain the present invention, and are not suitable for limiting the present invention.

[0041] In this example, if figure 1 As shown, the galvanometer correction device includes:

[0042] Vacuum suction wafer stage 1, such as figure 2 As shown, the PSD device 3 is attached thereon, and the adsorption and fixation of the calibration substrate 2 can be completed. The vacuum chamber is formed by the wafer stage base 103, the wafer stage base plate 105, the wafer stage frame 101, the honeycomb board 102 and the polyurethane round belt 104, and the vacuum chamber is connected with the vacuum cleaner through a spring hose; the calibration substrate 2 is placed on the honeycomb board 102. The small residue generated during the processing enters the vacuum cleaner through the core hole on the honeycomb panel 102 , the through hole of the wafer base 105 and the cavity of the wafer base 103 . The polyurethane round ...

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Abstract

The invention provides a correction method of a galvanometer system correction device, and relates to the technical field of precision laser processing equipment. The correction method mainly comprises steps of: model updating demand judgment, correction sample data collection, single strain transformation model calculation, galvanometer scanning distortion model calculation, nonlinear compensation calculation optimization (1005), model effect (1006) and processing data input. By using the galvanometer system correction device, a PSD data collection method or a CCD data collection method is used for finishing the correction sample data collection step necessary before the galvanometer correction, further achieving establishment, update and effecting of the galvanometer correction model including two models of single strain transformation and galvanometer scanning. The model effects on, namely a real time correction process based on the ''nonlinear compensation'' strategy so as to offset the influence of the galvanometer scanning distortion, thereby reducing and restraining the composition error of the galvanometer scanning system.

Description

technical field [0001] The invention relates to the technical field of laser precision processing equipment, in particular to a correction device for a vibrating mirror system in laser precision processing equipment. Background technique [0002] At present, laser processing (including laser marking, drilling and cutting, etc.) technology has been widely used in the fields of semiconductor chips, microelectronic circuits and hybrid integrated circuit packaging. Due to the small inertia, extremely fast acceleration and deceleration, and the processing speed can be as high as 12m / s, the galvanometer system is usually integrated into the laser processing equipment as a core component. However, the ever-changing high-density packaging and high-density interconnection technology (HDI) also put forward higher requirements for the accuracy of the whole machine (the accuracy of the whole machine is better than +-15um). Often, the introduction of a galvo system introduces various er...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/70
Inventor 孟凡辉许志伟
Owner THE 45TH RES INST OF CETC
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