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Stripping and removal of organic-containing materials from electronic device substrate surfaces

A technology for substrates and organics, applied in the field of stripping and removing organic coating materials from the surface of electronic device substrates

Inactive Publication Date: 2010-08-25
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, acetic acid is solid at temperatures below about 16.7°C, which may cause some problems under certain desired processing conditions

Method used

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  • Stripping and removal of organic-containing materials from electronic device substrate surfaces
  • Stripping and removal of organic-containing materials from electronic device substrate surfaces
  • Stripping and removal of organic-containing materials from electronic device substrate surfaces

Examples

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Abstract

Described herein is a method of removing an organic-containing material from an exposed surface of a large substrate (at least 0.25 m2). The substrate may comprise an electronic device. The exposed surface is treated with a stripping solution comprising ozone (O3) in a solvent, where the solvent comprises acetic anhydride. The stripping solvent used to form the stripping solution may comprise a mixture of acetic anhydride with a co-solvent selected from the group consisting of a carbonate containing 2 - 4 carbon atoms, ethylene glycol diacetate, and combinations thereof. In some instances, the stripping solution, may contain only acetic anhydride and ozone, where the ozone concentration is typically about 300 ppm or greater.

Description

technical field The present invention relates to the removal of organic-containing materials such as photoresists, high temperature organic layers and organic dielectric materials from the surface of flat panel displays or solar cell arrays or other large scale substrates (typically larger than about 0.5 meter by 0.5 meter substrate) )Methods. Background technique Information is provided in the Background section of this application to enable the reader of this application to better understand the invention described next. The presence of information in the Background section of this application is not an admission that the information presented, or combination of information presented, is background art to the invention. The fabrication of electronic devices is complicated by the large number of different materials that are used to provide elements of functional devices or serve as temporary process structures during the fabrication of the devices. Because most devices c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/00B08B3/14B08B7/00C03C23/00C23G1/00C23G5/00
CPCC23G5/032G03F7/427C11D7/04C11D11/0047C11D7/266G03F7/423C11D2111/22
Inventor 史蒂文·维尔哈弗尔贝克
Owner APPLIED MATERIALS INC
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