High-power LED phase-change cooling device

Abstract

The invention relates to a high-power LED phase-change cooling device comprising an evaporating chamber, a circulating pump, a condensing heat radiator and a nozzle, wherein the evaporating chamber is a closed shell and is provided with an evaporating plate and a back plate which are oppositely arranged; the evaporating plate is a metal plate; the outer side of the evaporating plate is welded with an LED lamp, and the inner side of the same is connected with a porous metal plate or a screen mesh; the nozzle is arranged at the inner side of the back plate and points to the evaporating plate; the circulating pump and the condensing heat radiator are arranged outside the evaporating chamber; the shell of the evaporating chamber is provided with an outlet positioned below the nozzle; a pipeline is sequentially connected with the outlet of the evaporating chamber, the circulating pump and the condensing heat radiator and then communicated with the nozzle by penetrating through the back plate of the evaporating chamber so that a closed loop is formed by the evaporating chamber, a micropump and the condensing heat radiator; and the evaporating chamber is internally provided with a cooling working medium. The invention has the advantages of good radiating reliability, high radiating efficiency, compact structure, convenient processing, low manufacturing cost and higher practicality, and is suitable for industrialized batch production.

Description

technical field [0001] The invention relates to a cooling device for high-power electronic or optical devices, in particular to a cooling device for high-power LED (light emitting diode, light emitting diode). Background technique [0002] Traditional cooling methods for high-power devices usually use cooling media to transfer the heat generated by the heat-generating device to the atmospheric environment outside the device through conduction and convection to achieve temperature control inside the device. For harsh working environment, the heat flux density exceeds 100W / CM 2 For high-power LEDs, the heat generated inside is difficult to cool the high-power LEDs through the above-mentioned traditional methods. Preventing the LED temperature from rising too high is the core problem that must be solved in the application of high-power LED devices. At present, methods of improving LED substrate materials and packaging structures are widely used at home and abroad to improve th...

AI Technical Summary

Problems solved by technology

When using heat pipes for lighting, if the heat pipes are bent, the cooling efficiency will drop sharply due to the fact that the gas and liquid in the traditional heat pipes are in the same pipe

However, in order to meet the needs of styling, the heat pipe of high-power LED must be bent, so the traditional heat pipe is difficult to reliably solve the cooling problem of high-power LED

In addition, the existing loop heat pipe technology is directly used in the heat dissipation of high-power LEDs, such as high manufacturing cost, inconvenient processing, and too complicated capillary structure, etc., cooling with traditional heat pipes is not conducive to the marketization of high-power LEDs

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