High-power LED phase-change cooling device

A phase-change cooling, high-power technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of difficult and reliable cooling of high-power LEDs, unfavorable marketization of high-power LEDs, and complex capillary structures. Low cost, strong practicability, good heat dissipation reliability

Inactive Publication Date: 2010-09-08
赵继永
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using heat pipes for lighting, if the heat pipes are bent, the cooling efficiency will drop sharply due to the fact that the gas and liquid in the traditional heat pipes are in the same pipe
However, in order to meet the needs of styling, the heat pipe of high-power LED must be bent, so the traditional heat pipe is difficult to reliably solve

Method used

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  • High-power LED phase-change cooling device

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Embodiment Construction

[0015] When a phase change material changes from one state to another, it needs to absorb or release heat from the environment, which can realize heat storage and release, and can achieve the purpose of temperature control. When the liquid state changes into the gaseous state, a large amount of heat is absorbed, and when the gaseous state condenses into a liquid state, heat is released. At the same time, the phase change process is generally an isothermal or nearly isothermal process. Using the characteristics of phase change materials, small The environment is temperature controlled and can be reused many times.

[0016] See figure 1 The high-power LED has a transparent lampshade 7 arranged on the front of the LED lamp 9 and a rear cover 8 connected to the transparent lampshade 7 and is located at the rear of the LED lamp 9. The phase change cooling device of the high-power LED has a transparent lampshade 7 and The evaporation chamber 1 in the rear cover 8, the nozzle 4 arra...

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Abstract

The invention relates to a high-power LED phase-change cooling device comprising an evaporating chamber, a circulating pump, a condensing heat radiator and a nozzle, wherein the evaporating chamber is a closed shell and is provided with an evaporating plate and a back plate which are oppositely arranged; the evaporating plate is a metal plate; the outer side of the evaporating plate is welded with an LED lamp, and the inner side of the same is connected with a porous metal plate or a screen mesh; the nozzle is arranged at the inner side of the back plate and points to the evaporating plate; the circulating pump and the condensing heat radiator are arranged outside the evaporating chamber; the shell of the evaporating chamber is provided with an outlet positioned below the nozzle; a pipeline is sequentially connected with the outlet of the evaporating chamber, the circulating pump and the condensing heat radiator and then communicated with the nozzle by penetrating through the back plate of the evaporating chamber so that a closed loop is formed by the evaporating chamber, a micropump and the condensing heat radiator; and the evaporating chamber is internally provided with a cooling working medium. The invention has the advantages of good radiating reliability, high radiating efficiency, compact structure, convenient processing, low manufacturing cost and higher practicality, and is suitable for industrialized batch production.

Description

technical field [0001] The invention relates to a cooling device for high-power electronic or optical devices, in particular to a cooling device for high-power LED (light emitting diode, light emitting diode). Background technique [0002] Traditional cooling methods for high-power devices usually use cooling media to transfer the heat generated by the heat-generating device to the atmospheric environment outside the device through conduction and convection to achieve temperature control inside the device. For harsh working environment, the heat flux density exceeds 100W / CM 2 For high-power LEDs, the heat generated inside is difficult to cool the high-power LEDs through the above-mentioned traditional methods. Preventing the LED temperature from rising too high is the core problem that must be solved in the application of high-power LED devices. At present, methods of improving LED substrate materials and packaging structures are widely used at home and abroad to improve th...

Claims

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Application Information

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IPC IPC(8): H01L33/00
Inventor 赵继永
Owner 赵继永
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