Coil electric conductor device and manufacture method thereof

A coil conductor and manufacturing method technology, applied in coil manufacturing, coils, electrical components, etc., can solve the problems of large overall height, troublesome use of devices, short circuit of coil conductors, etc., to increase the connection area, improve connection reliability, reduce The effect of the possibility of a short circuit

Active Publication Date: 2010-09-15
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, at the connection point, due to the superposition of the height of the conductor and the height of the connection point, the total height here is larger than that of other parts, which is easy to cause

Method used

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  • Coil electric conductor device and manufacture method thereof
  • Coil electric conductor device and manufacture method thereof
  • Coil electric conductor device and manufacture method thereof

Examples

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[0031] The present invention will be further described below in conjunction with the drawings and preferred embodiments.

[0032] An embodiment of a coil electric conductor device of the present invention figure 1 , figure 2 with image 3 Shown.

[0033] Such as figure 1 As shown, the coil conductor 12, the lead-out terminal 13, the connection point 14, the connection point 15, and the slurry layer 11 are laminated to form a spiral coil-shaped coil device. Such as Figure 8 As shown, a small cavity 82 is formed at the end of the coil conductor 81, and the connection point 15 is printed on the end 82.

[0034] Such as Picture 9 Shown is a top view from above of this embodiment. Among them, the ceramic layer 94, the lead terminal 92, the connection point 93 and the coil conductor 91 overlap the state obtained. versus Figure 4 Compared with the cross-sectional view showing the center of the coil electrical conductor device, external electrodes are formed at the two ends of the el...

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PUM

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Abstract

The invention provides a coil electric conductor device and a manufacture method thereof. The method comprises the following steps of: a lower leading-out end step, a coil conductor step, a casting step and an upper leading-out end step, wherein the coil conductor step comprises a connection point step: printing a coil conductor, wherein cavities can be generated at the tip position of a lower leading-out end and the middle position of the tip position of the coil conductor if the thickness of the tip position of the coil conductor is less than that of the middle part of the coil conductor; drying again; printing first connection points at the positions of the cavities; then casting a layer of ferrite pulp film; and printing second connection points the area of which is larger than that of the first connection points on the first connection points after the ferrite pulp film is dried; in the casting step, casting a layer of ferrite pulp film, and exposing the second connection points out of the ferrite pulp film; drying, and then repeating the coil conductor step, the connection point step and the casting step on the ferrite pulp film for several times so as to form the coil conductor.

Description

technical field [0001] The invention relates to a manufacturing method of a coil electric conductor device and the coil electric conductor device. Background technique [0002] Conventionally, a laminated coil device such as a chip inductor device includes laminated ceramic layers and a coil conductor having a certain shape, and the coil conductor ends are connected between layers through connection points to form a spiral coil conductor. [0003] In recent years, with the wide application of electronic components, while paying attention to the performance of components, the requirements for miniaturization and low thickness of components are becoming more and more intense. In order to meet these requirements, the line width and thickness of coil conductors need to be thinner. To get bigger, on the other hand, the ceramic layer has to get thinner. However, if the thickness of the coil conductor is increased and the ceramic layer is thinned, the thickness of the overlapped p...

Claims

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Application Information

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IPC IPC(8): H01F5/00H01F41/04H05K1/16
Inventor 曾向东施素立王清华
Owner SHENZHEN SUNLORD ELECTRONICS
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