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Manufacture process of sectional golden finger

A manufacturing method and gold finger technology, applied in the direction of the formation of electrical connection of printed components, can solve problems such as unstable connection, and achieve the effects of not easily falling off, improving stability, and enhancing stability.

Active Publication Date: 2012-09-05
MEIZHOU ZHIHAO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problem that the gold finger of the existing printed circuit board may cause unstable connection, the present invention provides a segmented gold finger manufacturing method capable of forming a stable connection

Method used

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  • Manufacture process of sectional golden finger
  • Manufacture process of sectional golden finger

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Embodiment Construction

[0023] The segmented gold finger manufacturing method of the present invention is to form a segmented gold finger structure as shown in the accompanying drawings on the printed circuit board substrate, and the formed segmented gold finger structure can be connected with corresponding electronic components, A proper snap-fit ​​structure is formed to improve the stability of the golden finger connection.

[0024] The segmented gold finger manufacturing method mainly includes the following steps: providing plate→drilling→sinking copper plate electroplating→browning→outer layer image transfer→graphic electroplating→secondary dry film→electrohard gold→removing film etching→exposure Solder mask→text→gong board→form V-CUT→gold finger hypotenuse. Among them, the brief description of each step is as follows:

[0025] Step 1, provide the plate: provide a PCB substrate to be made of gold fingers, the PCB substrate will be used to make gold fingers on it after the processes of material c...

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Abstract

The invention provides a manufacture process of a sectional golden finger, wherein the structure of a golden finger is manufactured on a substrate. The structure of a golden finger comprises a segmented gold finger structure and a continuous gold finger structure. The method for manufacturing the segmented gold finger structure comprises the steps of providing a slab, drilling, copper-clad plate electrofacing, browning, outer-layer pattern converting, pattern plating, secondary film drying, solid gold plating, film removing and etching, exposing and solder mask, writing and piling plates. Therefore, a V-cut and a golden finger bevel are formed. The manufacture process of the sectional golden finger has the advantage of improving the stability of external connection of the golden finger.

Description

technical field [0001] The invention relates to a manufacturing method, in particular to a printed circuit board (PCB) manufacturing method for forming segmented golden fingers. Background technique [0002] With its many advantages such as low cost, high integration, portability and versatility, printed circuit boards currently occupy the high ground of many products in the industrialization era. [0003] The gold finger occupies an important position in the printed circuit board, because the gold finger is usually the front end of the electrical connection between the printed circuit board and the external electronic components, so its conductivity and connection stability are related to the quality of the printed circuit board. [0004] Common gold fingers are continuously extended, which may cause the connection stability of the gold finger to be not good enough, such as easy to fall off, when the gold finger is connected to the outside during use, which will affect the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40
Inventor 李叶飞张育猛
Owner MEIZHOU ZHIHAO ELECTRONICS TECH