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Radiator of main board

A heat sink and motherboard technology, which is applied in the field of radiators, can solve problems such as the temperature rise of the motherboard, and achieve the effects of improved heat dissipation, simple structure, and convenient use

Inactive Publication Date: 2010-10-06
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the heat generated by various heating elements will also be conducted to the copper foil in the computer motherboard through its pins, the temperature of the motherboard will increase.

Method used

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  • Radiator of main board
  • Radiator of main board
  • Radiator of main board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] Please refer to figure 1 , a preferred embodiment of the heat sink for the motherboard of the present invention is applied to an idle chip device area 14 of a motherboard 10 . The motherboard heat sink includes a heat sink 20 , several ground pins 30 , several support pins 40 and a packaging part 50 made of insulating material.

[0010] The idle chip device area 14 of the motherboard 10 is provided with a plurality of pads 15 . Some of these pads 15 are ground pads 151 , and others are non-ground pads 152 , and these ground pads 151 are connected to the ground plane of the motherboard 10 .

[0011] The heat sink 20 and the ground pins 30 are made of thermally conductive material. These ground pins 30 correspond to the ground pads 151 of the idle chip device area 14 of the motherboard 10 integrally formed on the heat sink 20, as figure 2 shown. The heat sink 20, the grounding pins 30, the support pins 40 and the package 50 can be packaged together as a whole, so tha...

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Abstract

The invention discloses a radiator of a main body, which comprises an encapsulation part, a radiation part and a plurality of earthing pins, wherein the radiation part is prepared from a heat conducting material and extends out of the top part of the encapsulation part; the plurality of earthing pins extend downwards out of the encapsulation part and are made of the heat conducting material; the upper parts of the earthing pins contact the radiation part; and the earthing pins are used to be welded with a plurality of earth soldering-pans in an idle corresponding chip device area of the main board. The radiator of the main board improves radiation capability of the main board, has a simple structure and is convenient to use.

Description

technical field [0001] The invention relates to a radiator for a main board. Background technique [0002] In a computer system, the general heat dissipation method is to install a heat sink on the heating element or install a fan in the casing. However, because the heat generated by various heating elements is also conducted to the copper foil in the computer motherboard through its pins, the temperature of the motherboard is increased. While the motherboard dissipates its heat to the surrounding air, it is also necessary to install a radiator to dissipate heat from the motherboard, so as to further reduce the temperature of the motherboard and the heating elements on it, thereby reducing the system temperature. Contents of the invention [0003] In view of the above, it is necessary to provide a heat sink that can improve the cooling capacity of the motherboard. [0004] A heat sink for a motherboard, comprising an encapsulation part, a heat sink made of heat-conductin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H01L23/367
CPCH01L23/36G06F1/20H01L2924/0002H01L2924/00
Inventor 孙正衡
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD