Method and device for infiltrating reinforced material and resin glue continuously
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGMEN HINNO TECH
- Publication Date
- 2010-10-13
- Estimated Expiration
- Not applicable ยท inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to the production method and equipment technology field of prepreg used in copper-clad laminates, in particular to a method and device for continuously infiltrating reinforcing materials and resin glue to achieve good wettability. Background technique
[0002] As we all know, in the circuit board manufacturing industry, copper clad laminates become the basic material for circuit board processing, and the quality of copper clad laminates will also directly affect the performance of circuit boards, which means that the processing of prepregs (adhesive sheets) in the field of copper clad laminates is particularly important ; The prepreg is obtained by soaking the semi-finished reinforcing material (glass fiber cloth, fiber paper, etc.) in epoxy resin glue and heating and drying the soaked reinforcing material.
[0003] In the prior art, there are many ways to infiltrate the reinforcing material with the resin glue. For exampl...