Determination method and device for dry cleaning time and plasma processing apparatus

A technology of dry cleaning and determination method, which is applied in the field of plasma, can solve the problems of shortening the service life of equipment, reducing production efficiency, prolonging cleaning time, etc., and achieve the effect of improving system production efficiency, prolonging service life and high efficiency

Active Publication Date: 2010-10-13
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Description
  • Claims
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Problems solved by technology

However, in practical applications, in order to make this method applicable to different process chambers, the overcleaning time is often set to be relatively long, which will not only

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  • Determination method and device for dry cleaning time and plasma processing apparatus
  • Determination method and device for dry cleaning time and plasma processing apparatus
  • Determination method and device for dry cleaning time and plasma processing apparatus

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[0040] The core of the present invention is to use the characteristic that different compounds have the inherent infrared absorption wavelength corresponding to their characteristics, and the infrared spectrometer is used to monitor the infrared absorption spectrum of the attachments on the inner wall of the process chamber in real time, and the infrared absorption spectrum is the first in the infrared absorption spectrum. A time point is selected between the time corresponding to the sag point and the time corresponding to the second sag point, and it is used as the end time of the cleaning process of the cleaning gas. It should be pointed out here that the inner wall of the chamber mentioned in this application includes the side wall of the chamber and the quartz window above the chamber.

[0041] In order to enable those skilled in the art to better understand the technical solution of the present invention, a plasma processing device having a plasma processing chamber is taken...

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Abstract

The invention provides a determination method for dry cleaning time, comprising the following steps of: step 100, cleaning attachments on the inner wall of a plasma process chamber by means of a cleaning gas, and measuring the infrared absorption spectrum of the attachments on the inner wall of the chamber by an infrared spectrograph; and step 300, determining the final time of the cleaning treatment of the cleaning gas according to the infrared absorption spectrum of the attachments. The invention further provides a dry cleaning method for the process chamber and a plasma processing apparatus using the method. In addition, the invention further provides a determination device for dry cleaning time and a plasma processing apparatus using the device. The method/device and the apparatus provided by the invention can precisely determine the final time of the dry cleaning of the process chamber, improve the production efficiency of the process, and prolong the service life of the process chamber and the inner parts thereof.

Description

technical field [0001] The present invention relates to the field of plasma technology, in particular, to a method / device for determining dry cleaning time, and a dry cleaning method. In addition, the present invention also relates to plasma processing equipment using the above method and / or device. Background technique [0002] In today's society, integrated circuits have been applied to all aspects of life. At the same time, users have put forward higher requirements for the stability and uniformity of products. Therefore, manufacturers must constantly improve their own production processes to meet new market demands. [0003] In actual production, plasma processing equipment used for producing / processing integrated circuits, etc. needs to be cleaned regularly to remove reaction by-products attached to the inner wall. At present, the more effective cleaning method is wet cleaning, which uses chemical reagents and a series of cleaning processes to achieve the purpose of ...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/66B08B5/02
Inventor 白志民
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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