Radiating fin and semiconductor packaging structure

Abstract

The invention relates to a radiating fin, comprising a radiating part and a supporting part. The supporting part extends along the direction far away from the radiating part from the edge of the radiating part; the tip of the supporting part is provided with a plurality of butting parts, wherein, each butting part is provided with a bottom surface; and the normal direction and the vertical direction of the bottom surface form an angle which is more than 5 degrees. The invention further provides a semiconductor packaging structure.

Description

technical field [0001] The invention relates to a semiconductor packaging component, in particular to a heat sink and a semiconductor packaging structure. Background technique [0002] As the operating speed of the chip is increasing day by day, how to effectively remove the huge heat energy generated during the operation of the chip is an important issue in the semiconductor packaging structure when the chip is packaged. The heat sink has a simple process and can achieve the purpose of heat dissipation. [0003] Please refer to figure 1 As shown, it shows a conventional semiconductor package structure 90 with a heat sink, which includes a substrate 91, a chip 92, a die-bonding glue 93, several bonding wires 94, a heat sink 95 and a sealant 96 . The chip 92 is adhered on the substrate 91 through the die-bonding glue 93 , and is electrically connected to the substrate 91 through the bonding wires 94 . The heat sink 95 is disposed above the chip 92 and adhered to the subst...

AI Technical Summary

Problems solved by technology

Although in this kind of semiconductor chip packaging structure, the heat sink can be positioned on the substrate by fitting the second fitting portion into the first fitting portion, but the first fitting such as a cavity is provided on the substrate. part must change the design of the substrate, and the first fitting part will occupy the design area of ​​the circuit of the substrate, so when the area of ​​the substrate and the pitch of the circuit are gradually reduced, it will increase the difficulty of designing and manufacturing the substrate

[0006] Therefore, there is still a need to provide a new heat sink structure to solve the problem of positional offset between the heat sink and the substrate in the prior art

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