White LED light source package

A technology of LED light source and LED chip, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of uniform coating of phosphor layers and uneven output light, etc.

Inactive Publication Date: 2010-10-13
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The factors that affect the outgoing light are mainly the phosphor layer and its coating method. The traditional phosphor layer is coa

Method used

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  • White LED light source package
  • White LED light source package
  • White LED light source package

Examples

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Example Embodiment

[0012] The white LED light source package of the present invention will be described in detail below with reference to the accompanying drawings: please refer to figure 1 As shown, the white LED light source package of the present invention includes a heat sink 8, an insulating substrate bonded on the upper surface of the heat sink 8, a number of LED chips bonded on the upper surface of the insulating substrate 1 and arranged in an array, 2. A number of reflective condenser cups 3 on the substrate 1 and surrounding each LED chip 2, the epoxy resin film 4 coated on the upper surface of the insulating substrate 1, and the reflective light coated on both sides of the epoxy resin film 4 For the cup 5, the phosphor layer 6 coated on the upper surface of the epoxy resin film 4, and the glass 7 covering the upper surface of the phosphor layer 6, the power supply is connected to the electrodes at both ends of the LED chip 2 respectively.

[0013] The material of the insulating substrate 1...

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Abstract

The invention provides a white LED light source package, which comprises a heat sink (8), an insulating substrate (1) bonded on the upper surface of the heat sink (8), an LED chip (2) bonded on the upper surface of the insulating substrate (1), a reflection spotlight cup (3) arranged around the LED chip, an epoxy resin layer (4) fixed on the upper surface of the insulating substrate (1), reflection cups (5) coated at both side surfaces of the epoxy resin layer (4), a fluorescent powder layer (6) coated on the upper surface of the epoxy resin layer (4), and glass (7) covering the upper surface of the fluorescent powder layer (6), wherein a power source is connected on an electrode of the LED chip (2), and the LED chip (2) array is arranged on the upper surface of the insulating substrate, so the emergent light of the white LED light source package is more uniform.

Description

technical field [0001] The invention relates to a light source package, in particular to a white LED light source package. Background technique [0002] LED (Lighting Emitting Diode) is a light-emitting diode, which is a semiconductor solid-state light-emitting device. At present, the concern about the global energy shortage is rising again. Therefore, saving energy is an important issue that we will face in the future. [0003] In the field of lighting, LEDs are widely used in various indications, displays, decorations, backlights, general lighting and urban night scenes due to their characteristics of energy saving, environmental protection, long life, and small size. Therefore, they attract the attention of the world. The LED manufacturing process is divided into chip manufacturing and packaging. Among them, the LED packaging process is a very important task. Otherwise, the LED light loss will be serious, the luminous flux and luminous efficiency will be low, the light c...

Claims

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Application Information

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IPC IPC(8): H01L25/13H01L33/48H01L33/50
Inventor 张方辉阎洪刚席俭飞蒋谦刘丁菡
Owner SHAANXI UNIV OF SCI & TECH
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