System for testing phase transformation cooling effect of electronic components

Abstract

The invention discloses a system for testing phase transformation cooling effect of electronic components, comprising an evaporation chamber, a refrigerant temperature control system, an electronic component fixing device, a condensation and pressure regulation system, a data acquisition system and a visual observation system. The evaporation chamber contains a refrigerant for cooling the phase transformation of the electronic component to be tested; the refrigerant temperature control system is used for controlling the temperature of the refrigerant; electronic component fixing device is used for fixing the electronic component to be tested in the refrigerant of the evaporation chamber; the condensation and pressure regulation system is used for condensing and reflowing the steam generated in the evaporation chamber and monitoring the pressure of the steam; the data acquisition system is used for measuring, acquiring and monitoring the surface temperature of the refrigerant and the electronic component to be tested; the visual observation system is used for observing the boiling bubble behavior on the surface of the electronic component to be tested in the evaporation chamber to obtain the kinetic parameter of the bubbles. The test system of the invention can be used to evaluate the cooling effect of the phase transformation under the conditions of different materials, surface shapes, locations and inclined angles of the electronic components, and different refrigerants and degrees of super cooling.

Description

technical field [0001] The invention relates to a test system, in particular to a test system for the cooling effect of phase change cooling for thermal control of electronic components with high heat flux density. Background technique [0002] The application of electronic components pervades all aspects of daily life, production and even national security. Miniaturization and high density are the development direction of microelectronic components. Since 1959, with the advent of silicon integrated circuits, the integration of chips has grown at a rate of 40% to 50% per year, and the heat flux in integrated circuit chips has changed from 10W / cm in the 1970s 2 Increased to the current over 100W / cm 2 . Some microsystems have a heat flux as high as 1000W / cm 2 . According to the famous "Moore's Law" calculation: the number of transistors on a chip doubles every 18 months, then by 2010, the number of transistors on a chip will exceed 1 billion. The rapid development of mic...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the defects of the existing test system that lacks the immersion phase change cooling effect on electronic components, and provide an electronic component that can effectively test the phase change cooling effect of electronic components Test system for phase change cooling effect

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