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Jet solder vessel

A spray soldering and soldering technology, which is applied in the field of spray solder bath, can solve problems such as poor soldering, unstable oxygen concentration on the solder surface, and inability to suppress sharpening, so as to ensure wettability, reduce oxygen concentration, and suppress pull sharp effect

Active Publication Date: 2014-07-16
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since it is a direct type that sprays a strong inert gas directly on the printed circuit board, the nitrogen gas diffuses and the oxygen concentration on the solder surface is not constant
As a result, there are problems that the oxidation of the solder cannot be completely prevented, and peaking cannot be suppressed.
[0009] In addition, with the structure of Patent Document 1, when there are a plurality of solder nozzles for local soldering in one jet flow solder tank, there is a problem that the oxygen concentration cannot be individually changed.
Depending on various conditions such as the type of electronic parts placed on the printed circuit board, the number of leads, and the placement position, the oxygen concentration that is most suitable for soldering changes. Therefore, if the oxygen concentration cannot be changed individually, soldering may occur. bad

Method used

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Examples

Experimental program
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no. 1 Embodiment approach

[0023] Such as Figure 1~3 As shown, the jet flow solder tank 1 of the present embodiment is composed of a solder storage unit 2 , a nozzle unit 3 , a duct unit 7 , a pump unit 10 , and a supply device 4 .

[0024] Solder 20 is housed in the solder container 2 . The solder 20 is, for example, lead-free solder and is composed of Sn—Ag—Cu, Sn—Zn—Bi, or the like. The pump part 10, the duct part 7, and the nozzle part 3 which are injection means are provided in the solder storage part 2. As shown in FIG. The jet solder bath 1 uses a pump unit 10 to spray the solder 20 contained in the solder storage unit 2 through the duct unit 7 and from the nozzle unit 3 onto a printed circuit board (not shown).

[0025] The pump unit 10 has a motor, an impeller 11 and a shaft 12 (not shown). When the motor is driven, the shaft 12 rotates the impeller 11 to spray the solder 20 melted by a heater (not shown), and the solder 20 flows into the duct portion 7 in a predetermined flow direction. T...

no. 2 Embodiment approach

[0042] In this embodiment, the supply device 4A in which supply ports are arranged at uneven intervals will be described. Since members with the same names and reference numerals as those in the above-described embodiments and examples have the same functions, description thereof will be omitted.

[0043] Such as Image 6 As shown, the supply device 4A includes a cover body portion 40 and a supply tube 45A. The supply pipe 45A is provided to surround the opening 43 . Supply ports 46A, 47A, 48A, and 49A are provided in the supply pipe 45A. The supply ports 46A, 47A, 48A, and 49A are formed on the side wall 42 for supplying nitrogen gas toward the side wall 42 .

[0044] The supply ports 46A are arranged at the same interval as the interval between the supply ports 46 described in the above embodiment. The size of the supply port 46A is the same as that of the supply port 46 . The supply ports 47A are arranged such that the interval between the supply ports 47A is smaller t...

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PUM

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Abstract

The invention provides a Jet solder vessel. The Jet solder vessel can prevent tin soldering oxygenation injected from the nozzle. A cover body part has an opening for inserting of the nozzle part and a lateral wall located at the outside of the opening, the cover body part covers one part of the soldering tin storage part. A supply tube has a plurality of supply ports for supplying nitrogen to the lateral wall side, the supply tube is provided between the opening and the lateral wall in a mode of enclosing the surrounding of the opening. Therefore, the nitrogen supplied from the supply ports faces to the lateral wall to supply, and is stored between the nozzle part, the lateral wall and the liquid level of the soldering tin. The gas density of the stored nitrogen becomes higher. The nitrogen with high gas density ejects from the opening, and injects the nitrogen to the soldering tin injected from the nozzle part. Therefore, the soldering tin oxygenation can be prevented. As a result, imperfect bridging and imperfect solder projection caused by that the soldering tin is adhered outside the prescribed positions.

Description

technical field [0001] The present invention relates to a jet flow solder bath in which molten solder accommodated in a solder container is flowed by means of a jetting member, jetted from a nozzle, and gas is jetted to the jetted solder. Background technique [0002] As a method of soldering a printed wiring board, there is a dipping method in which a printed wiring board is brought into contact with molten solder and soldered. In this dipping method, flux is applied to the printed circuit board with a flux applicator installed in the soldering device, the applied part is preheated with a preheater, the solder is adhered with a jet solder bath, and the cooling device is used. Cooling treatment for soldering. [0003] The jet solder bath installed in the soldering device is composed of a solder container for storing solder, a nozzle, a pipe, a pump, and the like. In this jet flow solder bath, the electric heater melts the solder contained in the solder container, and the p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34B23K3/06
Inventor 大清水和宪高口彰桥本昇
Owner SENJU METAL IND CO LTD
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