Halogen-free flame retardant reinforced polyamide composition and molded product thereof

A technology of polyamide composition and polyamide resin, which is applied in the field of halogen-free flame-retardant reinforced polyamide composition, can solve problems such as serious mold fouling, and achieve the goals of reduced gas generation, less gas volume, and excellent flame retardancy Effect

Inactive Publication Date: 2010-11-24
KINGFA SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present inventor tried the effect of each flame retardant synergistic method in the above-mentioned patent in the semi-aromatic polyamide composition, and the results showed that: In the process, the amou

Method used

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  • Halogen-free flame retardant reinforced polyamide composition and molded product thereof
  • Halogen-free flame retardant reinforced polyamide composition and molded product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5 and comparative Embodiment 1-4

[0031] Table 1

[0032]

implement

example 1

implement

Example 2

implement

Example 3

implement

Example 4

implement

Example 5

Compared

example 1

Compared

Example 2

Compared

Example 3

Compared

Example 4

Polyamide 6T / 66

55.4

-

-

-

-

51

-

Polyamide 6T / 6I

-

55.4

-

-

-

-

51

-

Polyamide 10T

-

-

55.4

53.9

51.9

-

-

51

52.5

flame retardant

12

12

12

12

12

18

18

18

15

glass fiber

30

30

30

30

30

30

30

30

30

Anhydrous zinc borate

1

1

1

3

5

-

-

-

1

Nano Zinc Oxide

0.5

0.5

0.5

-

-

-

-

-

0.5

Molecular sieve

0.1

0.1

0.1

0.1

...

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PUM

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Abstract

The invention discloses a halogen-free flame retardant reinforced polyamide composition, which has the advantages of excellent flame retardance, toughness and flowability, less gas generated in the processing process, excellent thermal stability and color stability in the reflow soldering process needed by surface installation, and is particularly suitable for molding electronic connectors and the like. The polyamide composition comprises the following components in percentage by weight: (1) 35 to 70 percent of semi-aromatic polyamide resin, (2) 10 to 35 percent of fire retardant, (3) 15 to 50 percent of inorganic reinforcing filler, (4) 0.1 to 5 percent of synergetic flame retardant, and (5) 0.03 to 0.5 percent of molecular sieve.

Description

technical field [0001] The invention relates to a polyamide composition, in particular to a halogen-free flame-retardant reinforced polyamide composition. Background technique [0002] Polyamide resin represented by nylon-6 and nylon-66 has excellent mechanical strength, heat resistance, chemical resistance, wear resistance and self-lubricating property, and low friction coefficient. Its wide application fields include electronic appliances , auto parts, furniture, building materials and fibers, has become one of the most important engineering plastics. [0003] In the electrical and electronic field, with the development of surface mount technology, the resin used is required to have reflow soldering heat resistance. Especially in recent years, from the viewpoint of environmental protection, the surface mount technology of lead-free soldering has developed rapidly. Lead-free soldering tends to require higher reflow temperatures than the lead and tin eutectic solders widel...

Claims

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Application Information

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IPC IPC(8): C08L77/00C08L77/06C08K13/04C08K7/14C08K5/5313C08K3/34C08K3/38C08K3/22
Inventor 龙杰明姜苏俊曹民曾祥斌陈健易庆峰蔡彤旻
Owner KINGFA SCI & TECH CO LTD
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