3results about How to "Reduce gas volume" patented technology

The invention relates to the technical field of liquid injection, and discloses a filling system and a filling method.The filling system comprises a valve set, a first valve set, a second valve set, a third valve set and a fourth valve set, the first valve set and the second valve set are communicated with a first opening of a two-way hydraulic unit, and the third valve set and the fourth valve set are communicated with a second opening of the two-way hydraulic unit; the vacuumizing piece is communicated with the first channel and the third channel; the liquid injection part is communicated with the second channel and the fourth channel; the filling system has a vacuumizing state, a first liquid injection state and a second liquid injection state, in the vacuumizing state, the first channel and the third channel are opened, and the second channel and the fourth channel are closed, in the first liquid injection state, the first channel and the fourth channel are opened, and the second channel and the third channel are closed, and in the second liquid injection state, the second channel and the third channel are opened. The first channel and the fourth channel are closed. The filling system can reduce the gas amount in the two-way hydraulic unit, increase the liquid filling amount in the two-way hydraulic unit, and improve the performance and reliability.

This invention discloses a method for cryogenic air separation and a suitable distillation column system. A high-pressure column and a low-pressure column are arranged side-by-side, with a first condenser-evaporator located at the bottom of the low-pressure column and a second condenser-evaporator located at the top. Oxygen-enriched stream from the bottom of the high-pressure column is fed into the low-pressure column for further distillation. The high-pressure liquid nitrogen generated by the first condenser-evaporator is depressurized and separated into gas and liquid phases in a gas-liquid separator. The liquid phase is then combined with the low-pressure liquid nitrogen generated by the second condenser-evaporator, pressurized by a liquid nitrogen pump, and fed into the high-pressure column as reflux liquid. The gaseous product in the gas-liquid separator is combined with the flash gas at the outlet of the liquid nitrogen pump and returned to the low-pressure column.

The application discloses a bonding method and a bonding device. The bonding method comprises the following steps: placing a wafer on a first supporting frame of a vacuum bonder; placing a bonding adhesive on a second supporting frame of the vacuum bonder, one of the first supporting frame and the second supporting frame has a size larger than a size of a cavity of the vacuum bonder, and the other has a size smaller than the size of the cavity; placing a carrier plate and the first supporting frame on opposite sides of the second supporting frame respectively and spacing the carrier plate and the first supporting frame from the bonding adhesive respectively, wherein the carrier plate is adsorbed on a bonding chuck of the vacuum bonder; aligning and approaching the carrier plate, the second supporting frame and the first supporting frame; and reducing the air pressure in the vacuum bonder through a suction port on a housing of the vacuum bonder to bond the carrier plate and the wafer together through the bonding adhesive. The method can reduce the amount of gas to be sucked out of the vacuum bonder, and the size of the first supporting frame or the second supporting frame is larger, which is convenient for taking the bonded combination.