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485 results about "Bis(trimethylsilyl)amine" patented technology

Bis(trimethylsilyl)amine (also known as hexamethyldisilazane and HMDS) is an organosilicon compound with the molecular formula [(CH₃)₃Si]₂NH. The molecule is a derivative of ammonia with trimethylsilyl groups in place of two hydrogen atoms. An electron diffraction study shows that silicon-nitrogen bond length (173.5 pm) and Si-N-Si bond angle (125.5ᵒ) to be similar to disilazane (in which methyl groups are replaced by hydrogen atoms) suggesting that steric factors are not decision in regulating angles. This colorless liquid is a reagent and a precursor to bases that are popular in organic synthesis and organometallic chemistry. Additionally, HMDS is also increasingly used as molecular precursor in chemical vapor deposition techniques to deposite silicon carbonitride thin films or coatings.

Double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive

The invention relates to a double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive, belonging to the technical field of electric insulation adhesives for binding and packaging electronic and electric appliance elements. The double-component low-hardness high-heat-conductivity room-temperature-curing organosilicon heat conducting adhesive comprises a component A and a component B, wherein the component A is prepared by mixing the following components in parts by weight: 100 parts of base material and 0.1-0.5 part of platinum catalyst; the component B is prepared by mixing the following components in parts by weight: 100 parts of base material, 0.1-10 parts of terminal-hydrogen-containing silicone oil, 0.1-10 parts of side-hydrogen-containing silicone oil and 0.01-1 part of inhibitor; and the base material is prepared by the following steps: mixing 100 parts by weight of divinyl silicone oil and 800-1500 parts by weight of aluminum oxide, treating with hexamethyldisilazane at 115-125 DEG C, and cooling to room temperature to obtain the base material. The adhesive has the advantages of high heat conductivity (up to 2.5-3.6 W / (m.k)), low hardness and ideal mechanical properties; and the adhesive can be closely combined with the electronic element, and therefore, can be ideally used for heat dissipation of high-power elements.
Owner:西卡(江苏)工业材料有限公司

Preparation method of super-hydrophobic nanoscale white carbon black membrane and super-hydrophobic nanoscale white carbon black powder

The invention provides a preparation method of a super-hydrophobic nanoscale white carbon black membrane and super-hydrophobic nanoscale white carbon black powder. The preparation method provided by the invention is characterized by comprising the following steps of 1, preparing nanoscale rice husk ash by a self-propagating combustion method, 2, adding the nanoscale rice husk ash into a NaOH solution having concentration of 1M in a way that each 1g of the nanoscale rice husk ash is added into 10ml of the NaOH solution, carrying out boiling, cooling, removing precipitated impurities, and adjusting a pH value to 3 by a HCl solution to obtain a sodium-silicon solution, and 3, preparing the super-hydrophobic nanoscale white carbon black membrane and the super-hydrophobic nanoscale white carbon black powder by an improved sol-gel method, wherein a used modifier is hydroxyl silicone oil or hexamethyldisilazane. The super-hydrophobic nanoscale white carbon black powder obtained by the preparation method has SiO2 content of 99.64%. The super-hydrophobic nanoscale white carbon black membrane has a wetting contact angle of 166.32 degrees. The super-hydrophobic nanoscale white carbon black membrane and the super-hydrophobic nanoscale white carbon black powder belong to the field of hydrophobic surfaces and can be utilized as water resistance agents, catalysts, catalyst carriers, raw materials of a petrochemical industry, decolorants, delustering agents, rubber strengthening agents, plastic fillers, printing ink thickening agents, metal soft polishing agents, insulative heat-insulation fillers, high-grade daily cosmetic fillers and spraying materials.
Owner:SHANDONG UNIV OF TECH
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