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Preparation method of submicron silica powder

A sub-micron, silica technology, applied in dyeing organosilicon compound treatment, dyeing physical treatment, dyeing low-molecular-weight organic compound treatment, etc. and other problems, to achieve the effect of low manufacturing cost, high production efficiency and short production cycle

Active Publication Date: 2014-03-12
JIANGSU NOVORAY NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantages of dry grinding are high grinding efficiency and high product yield, but its disadvantage is that it requires high classification equipment, and general classification equipment can rarely meet the requirements.
The wet grinding equipment is mainly a ball mill, but its main problems are low grinding efficiency, low product yield, and easy agglomeration of products, etc.
For example, patent CN102120581 uses powdered quartz as raw material to prepare ultra-fine quasi-spherical micro-silicon powder by secondary wet grinding. The disadvantage of this method is that the energy consumption of ultra-fine micro-silicon powder prepared by ball mill wet grinding is relatively high. In addition, the material Particle size -2μm ≥ 97%, the particle size can not reach the submicron level

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1, a kind of preparation method of submicron silicon dioxide, its steps are as follows:

[0022] (1) Dry grinding: select crystalline quartz or fused silica sand with a particle size of 2-40 mesh as raw materials and add them to a horizontal ball mill, and use alumina balls, silicon balls or zirconia balls as grinding media for dry grinding; after grinding The material is screened through the screen; the diameter of the grinding medium is 10-50mm; the mesh number of the screen is 200-300 mesh; the mass ratio of the raw material to the grinding medium is 1:1 during grinding, and the grinding time is 8-10 hours;

[0023] (2) Wet grinding: Mix the sieved material with dispersion medium and dispersant, put it into a horizontal sand mill, and use alumina balls, silicon carbide balls or zirconia balls as grinding media for wet grinding. The diameter of the grinding medium is 0.2-1.0mm; the dispersion medium is selected from one or more of water, ethanol, acetone, b...

Embodiment 2

[0026] Embodiment 2, a kind of preparation method of submicron silicon dioxide, its steps are as follows:

[0027] (1) Dry grinding: select crystalline quartz or fused silica sand with a particle size of 2-40 mesh as raw materials, add them to a horizontal ball mill, and use alumina balls, silicon balls or zirconia balls as grinding media for dry grinding; after grinding The material is screened through the screen; the diameter of the grinding medium is 10-50mm; the mesh number of the screen is 200-300 mesh; the mass ratio of the raw material and the grinding medium is 1: 4 during grinding, and the grinding time is 8-10 hours ;

[0028] (2) Wet grinding: Mix the sieved material with dispersion medium and dispersant, put it into a horizontal sand mill, and use alumina balls, silicon carbide balls or zirconia balls as grinding media for wet grinding. The diameter of the grinding medium is 0.2-1.0mm; the dispersion medium is selected from one or more of water, ethanol, acetone, ...

Embodiment 3

[0031] Embodiment 3, a kind of preparation method of submicron silicon dioxide, its steps are as follows:

[0032] (1) Dry grinding: select crystalline quartz or fused silica sand with a particle size of 2-40 mesh as raw materials, add them to a horizontal ball mill, and use alumina balls, silicon balls or zirconia balls as grinding media for dry grinding; after grinding The material is screened through the screen; the diameter of the grinding medium is 10-50mm; the mesh number of the screen is 200-300 mesh; the mass ratio of the raw material and the grinding medium is 1:2 during grinding, and the grinding time is 8-10 hours ;

[0033] (2) Wet grinding: Mix the sieved material with dispersion medium and dispersant, put it into a horizontal sand mill, and use alumina balls, silicon carbide balls or zirconia balls as grinding media for wet grinding. The diameter of the grinding medium is 0.2-1.0mm; the dispersion medium is selected from one or more of water, ethanol, acetone, b...

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Abstract

The invention discloses a preparation method of submicron silica powder and relates to the technical field of preparation of submicron materials. The preparation method comprises the following specific steps: placing raw materials in a ball mill and grinding the raw materials; screening the ground materials; adding the materials into a sand mill; adding water or an organic solvent used as a dispersion medium, simultaneously adding one or more of dispersing agents including a silane coupling agent, a titanate coupling agent and hexamethyl-disilazane and performing wet grinding; deironing the ground slurry through a slurry deironing device; carrying out filter pressing on the deironed slurry to obtain a filter cake, wherein clear liquid obtained by filter pressing can be continuously used as a dispersion medium. The preparation method is simple in process and high in efficiency; a product is low in manufacturing cost, high in yield, short in production period, free of agglomeration, controllable in size and suitable for industrial production.

Description

technical field [0001] The invention belongs to the technical field of non-metallic ore deep processing, and relates to a preparation method of submicron silicon micropowder. Background technique [0002] Compared with other common inorganic fillers, silica powder fillers exhibit better mechanical properties, heat resistance, dispersibility, electrical properties, etc. In addition, compared with talcum powder, aluminum hydroxide, E-glass fiber, etc., it has a lower dielectric constant and lower water absorption. It is widely used in CCL, ink, coating, silicone rubber, electronic packaging, precision manufacturing and other industries. However, with the advancement of science and technology, various industries have also put forward higher requirements for the particle size of silica powder, especially the demand for submicron silica powder with smaller particle size is becoming stronger and stronger. For example, electronic products such as mobile phones and computers are b...

Claims

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Application Information

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IPC IPC(8): C09C1/28C09C3/04C09C3/12C09C3/08
Inventor 孙小耀姜兵王敏
Owner JIANGSU NOVORAY NEW MATERIAL CO LTD
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