Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wafer carrying device

A wafer carrying and height adjustment device technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as reducing use efficiency, affecting film quality, and inability to adjust the height of the wafer table in real time, reaching time-consuming The effect of shortening, broadening the scope of use, and improving efficiency

Inactive Publication Date: 2012-08-01
上海技美科技股份有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

reduce efficiency
[0007] For wafers of different thicknesses, the height of the traditional wafer table cannot be adjusted in real time, and only a fixed value can be used, which affects the quality of the film.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer carrying device
  • Wafer carrying device
  • Wafer carrying device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] like figure 1 , figure 2 and image 3 As shown, the wafer carrying device includes a base 1, and the upper surface 11 of the base 1 is provided with a first groove (not shown in the figure). Four seat legs ( 121 , 122 , 123 , 124 ) are installed on the lower surface of the base 1 for supporting the base 1 . The upper surface 11 of the base 1 is provided with a third groove 13 .

[0042] The first platform 2 is movably installed in the first groove. The upper surface 21 of the first platen 2 is provided with a first vacuum groove 22 . There are more than two first vacuum grooves 22 (only one is marked in the figure), and each first vacuum groove 22 is arranged around the upper surface 21 of the first platform 2 . Each first vacuum groove 22 communicates with a first through hole 23 provided on the first platform 2 . During actual use, the wafer is placed on the upper surface 21 of the first platen 2, covers the first vacuum chamber 22, makes the first through hole...

Embodiment 2

[0048] like Figure 6 , Figure 7 and Figure 8 As shown, the wafer carrying device includes a base 1, and the upper surface 11 of the base 1 is provided with a first groove (not shown in the figure). Four seat legs ( 121 , 122 , 123 , 124 ) are installed on the lower surface of the base 1 for supporting the base 1 . The upper surface 11 of the base 1 is provided with a third groove 13 .

[0049] The first platform 2 is movably installed in the first groove. The upper surface 21 of the first platen 2 is provided with a first vacuum groove 22 . There are more than two first vacuum grooves 22 (only one is marked in the figure), and each first vacuum groove 22 is arranged around the upper surface 21 of the first platform 2 . Each first vacuum groove 22 communicates with a first through hole 23 provided on the first platform 2 . In actual use, the wafer is placed on the upper surface 21 of the first platform 2, and the first vacuum chamber 22 is covered, so that the first th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a wafer carrying device which is characterized by comprising a base and a first height adjusting device, wherein a first groove is arranged on the upper surface of the base; a movable first table disc is installed in the first groove; the first height adjusting device can adjust the relative height between the upper surface of the first table disc and the upper surface of the base; and the first height adjusting device is connected with the first table disc. The wafer carrying device of the invention can be used for coating cutting films for wafers of different sizes. When wafers of different sizes are coated with the cutting films, the table disc does not need to be changed, and the carrying device can be suitable for coating cutting films of different sizes only by simple adjustment. The adjustment and switching are convenient and quick with short time and high efficiency. The height of the table disc is adjustable, so the table disc can be suitable for coating wafers of different thickness more conveniently, thereby widening the usable range of the table disc and ensuring that the coating effect meets the requirements.

Description

technical field [0001] The invention relates to a wafer carrying device. Background technique [0002] When the wafer is covered with dicing film, the existing technology is to first place the wafer on the wafer table, put the frame on the base, then cover the wafer and the frame with the dicing film, and then use the roller to tightly adhere the dicing film Overlay on the wafer and frame to complete an overlay. Susceptors and wafer tables are carriers for supporting wafers. After the lamination is completed, the wafer and the frame can be glued together due to the stickiness of the dicing film. Wafers covered with dicing film are easy to cut. [0003] Wafers are available in various sizes such as 3 inches, 4 inches, 5 inches, 6 inches, and 8 inches, and the thickness ranges from 0.1mm to 0.725mm. The corresponding frames are available in two sizes: 6 inches and 8 inches. A 6-inch frame is used for dicing films below 6 inches, and an 8-inch frame is used for 8-inch wafer...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
Inventor 张明星
Owner 上海技美科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com