Inlayer circuit conduction structure of circuit board and manufacture method thereof
A technology of inner layer circuit and conduction structure, which is applied in the direction of multi-layer circuit manufacturing and electrical connection formation of printed components, etc. It can solve the problems of thick finished product, complicated manufacture process of conduction structure, high production cost, etc., so as to reduce thickness and cost The effect of low cost and simple production process
Inactive Publication Date: 2010-12-15
昆山市华升电路板有限公司
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Problems solved by technology
[0003] In the traditional process, the inner layer lines are separated by prepregs. The production process of the conduction structure is relatively complicated, and the thickness of the finished product is relatively thick, so the production cost is high.
Method used
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Embodiment
[0015] Embodiment: a circuit board inner circuit conduction structure, including two insulating substrates 1, two outer circuits 2 and a plurality of inner circuits 3, and the two outer circuits 2 are respectively fixed and formed on the surfaces of the two insulating substrates 1 facing away from each other Above, the plurality of inner layer circuits 3 are fixedly formed between two insulating substrates 1, and at least one adjacent two inner layer circuits 3 of the circuit board are fixedly filled and formed with an insulating protective film 4, the insulating protective film 4 To isolate the two adjacent inner-layer circuits 3, the insulating protective film 4 is provided with a number of conductive openings 40 according to the design, and the conductive openings 40 are fixedly filled with metal material 5, and the plurality of conductive openings 40 The metal material 5 connects and conducts two adjacent inner-layer circuits 3 correspondingly according to the design.
[0016...
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The invention discloses an inlayer circuit conduction structure of a circuit board and a manufacture method thereof. The inlayer structure is formed in a way that at least one pair of adjacent inlayer circuits is separated by an insulation protective film and forms a conduction structure. The manufacture method comprises the steps of: coating an insulation protective film with photosensitive property on the inlayer circuit after the inlayer circuit is manufactured; exposing the insulation protective film according to a design drawing and then developing an unwanted part of the insulation protective film through a development process to form a conduction opening; and depositing a copper layer on the surface of the insulation protective film by adopting a copper plating process and ensuring that the conduction opening is plated with copper fully, manufacturing the inlayer circuit on the copper layer to form the conduction of the adjacent inlayer circuits. Compared with a pressing, drilling and electric-plating process when the inlayer conduction is manufactured by using the traditional process, the invention has simple operation and lower cost; and the manufactured circuit board is thinner while achieving the requirement for inlayer conduction.
Description
Technical field [0001] The invention relates to a circuit board structure and a manufacturing method, in particular to a manufacturing method of an inner circuit conduction structure of a circuit board. Background technique [0002] The internal circuit conduction structure of the traditional process is to use a prepreg and copper foil to be laminated on a fabricated internal circuit, and then press and bond, and then drill and electroplate according to the traditional process to make the interlayer conduction structure (that is, the traditional through hole , Blind hole, buried hole production), and the inner layer circuit production of copper foil according to the traditional process. [0003] In the traditional process, the inner layer circuits are separated by prepregs, the manufacturing process of the conductive structure is relatively complicated, and the thickness of the finished product is relatively thick, and the manufacturing cost is relatively high. Summary of the inve...
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IPC IPC(8): H05K3/40H05K3/46
Inventor 黄坤唐雪明曹庆荣
Owner 昆山市华升电路板有限公司