Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Plate splicing process of laser nickel plates

A laser nickel and craft technology, applied in the direction of printing plate preparation, printing, etc., can solve the problems of poor flatness at the imposition seam, thick imposition seam, affecting the quality of laser anti-counterfeiting materials, etc., to achieve good flatness, strong operability, The effect of improving imposition quality

Inactive Publication Date: 2010-12-29
张雪飞
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Generally, the direct imposition of the laser nickel plate is made by applying conductive adhesive to the imposition seam, or by welding, but there are problems of thick imposition seam or poor flatness of the imposition seam. As a result, the seams of the remade master plate are more obvious, which affects the quality of the produced laser anti-counterfeiting materials

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plate splicing process of laser nickel plates
  • Plate splicing process of laser nickel plates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Please refer to Fig. 1 as shown in the schematic diagram of imposition structure of the present invention, a kind of imposition process of laser nickel plate, it is characterized in that comprising the following steps:

[0030] The first step: cutting the laser nickel plate with a thickness of 20-30 μm, and the cutting edge is straight and burr-free;

[0031] Pre-bonding: face up two laser nickel plates 1 and 2 with the same thickness, splice their straight and burr-free cutting edges relative to each other, and temporarily bond them together with adhesive tape;

[0032] Step 2: Put a magnetic rubber plate on a flat table, put a layer of copy paper on the magnetic rubber plate, turn the two pre-bonded laser nickel plates 1 and 2 over, and cover the magnetic rubber plate with the front facing down On the copy paper, splice the straight and burr-free cutting sides together, and the 8 seams are closely attached to each other;

[0033] Correction: Grind, smooth, and clean ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
widthaaaaaaaaaa
widthaaaaaaaaaa
Login to View More

Abstract

The invention relates to a plate splicing process of laser nickel plates, which comprises the following steps of: cutting the laser nickel plates with the thickness of 20-30mu m, wherein cut edges are flat and straight and have no burr; placing the two laser nickel plates with consistent thickness and downwards front surfaces on a magnetic rubber plate, oppositely splicing the respective cut edges which are flat and straight and have no burr, and mutually pressing a joint; bonding an adhesive tape at the joint of the back surfaces of the two laser nickel plates, and then bonding a double-faced adhesive tape with the width smaller than that of the adhesive tape at the middle part of the adhesive tape; pasting an reinforced nickel plate with the width larger than the adhesive tape to the double-faced adhesive tape, and wrapping the whole adhesive tape and the double-sided adhesive tape; and respectively bonding and fixing the reinforced nickel plate and the laser nickel plates at the left side and the right side of the reinforced nickel plate through the adhesive tape. The invention has the advantages that compared with the prior art, the invention has the key that plate cutting and plate splicing processes are different, the whole process is concise and novel, has strong operability, thinner plate splicing joint (which can be smaller than 0.1mm) and better evenness, can greatly improve the plate splicing quality and is applicable to the direct plate splicing of the laser nickel plates.

Description

technical field [0001] The invention relates to the technical field of packaging and printing, in particular to an imposition process of a laser nickel plate for producing laser anti-counterfeiting materials. Background technique [0002] Generally, the direct imposition of the laser nickel plate is made by applying conductive adhesive to the imposition seam, or by welding, but there are problems of thick imposition seam or poor flatness of the imposition seam. As a result, the patchwork of the master plate that has been reproduced is more obvious, which affects the quality of the laser anti-counterfeiting materials produced. Contents of the invention [0003] The problem to be solved by the present invention is to provide an imposition process of the laser nickel plate, so that the imposition seam of the laser nickel plate is less than 0.1mm, and the flatness of the imposition seam is better. [0004] The technical scheme adopted by the present invention to solve the abo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B41C1/00
Inventor 张雪飞
Owner 张雪飞
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com