Rectifier structure for moisture protection
A rectifier, lead frame technology, applied in semiconductor devices, electric solid state devices, semiconductor/solid state device components and other directions, can solve problems such as reliability failure
Inactive Publication Date: 2011-01-05
SUZHOU GOODARK ELECTRONICS CO LTD
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- Description
- Claims
- Application Information
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Problems solved by technology
The resulting reliability failure is one of the main challenges faced by the diode packaging process
[0003] Therefore, how to develop a rectifier for moisture-proof and solve the problem of moisture infiltration and delamination between epoxy and lead frame has become the direction of efforts of those skilled in the art.
Method used
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Embodiment
[0026] Embodiment: a rectifier structure for moisture protection,
[0027] It includes: a first lead frame 1, a second lead frame 2, a connecting piece 3, and a diode chip 4. One end of the first lead frame 1 is a support area 5 connected to the diode chip 4, and one end of the diode chip 4 is connected to the diode chip 4 through solder paste. The support area 5 is connected, and the other end of the first lead frame 1 is a lead area 6, and the lead area 6 of the first lead frame 1 serves as the current transmission end of the rectifier;
[0028] One end of the second lead frame 2 is a welding area 7 connected to one end of the connecting piece 3, the other end of the second lead frame 2 is a lead area 6, and the lead area 6 of the second lead frame 2 is used as the The current transmission end of the rectifier;
[0029] The other end of the connecting piece 3 is connected with the other end of the diode chip 4 by solder paste;
[0030] The area between the support area 5 a...
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The invention discloses a rectifier structure for moisture protection, which comprises a first lead frame, a second lead frame, a connection plate and a diode chip, wherein one end of the first lead frame is a supporting area connected with the diode chip, and one end of the diode chip is connected with the supporting area through soldering paste; one end of the second lead frame is a soldering area connected with one end of the connection plate; the other end of the connection plate is connected with the other end of the second diode through the soldering paste; a groove is formed in an area between the supporting area of the first lead frame and a pin area and extends from one side of the first lead frame to the other side of the first lead frame; a through hole is formed in an area between the supporting area of the first lead frame and the pin area; bosses are arranged on the two sides of the area between the supporting area of the first lead and the pin area. The rectifier of the invention can effectively prevent moisture seeping and solve the layering problem of an epoxy encapsulation body and the lead frames.
Description
technical field [0001] The present invention relates to a rectifier structure, in particular to a rectifier structure requiring a moisture-proof design. Background technique [0002] Rectifiers use the unidirectional conduction characteristics of diodes to rectify alternating current, so they are widely used in circuits that convert alternating current into direct current. The common structure of the existing diode products for moisture-proof or waterproof gas is a bending structure. When the thickness of the lead frame is not thick enough, the groove is not enough to block the penetration of water vapor during the reliability test. The simple bending structure, after the chemical softening process of cutting ribs and bending feet, is prone to delamination between the epoxy and the pins. The resulting reliability failure is one of the main challenges facing the diode packaging process. [0003] Therefore, how to develop a moisture-proof rectifier to solve the existing pro...
Claims
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IPC IPC(8): H01L23/495
CPCH01L24/34H01L2224/40247H01L2224/32245H01L2224/73263H01L2224/40095H01L2924/181H01L2224/4007H01L2924/00014H01L2224/84385H01L2224/84801H01L24/84H01L24/40H01L24/37H01L2224/84345H01L2924/00012H01L2224/37099
Inventor 张雄杰何洪运姜旭波程琳
Owner SUZHOU GOODARK ELECTRONICS CO LTD