Single-side double-layer copper substrate and manufacturing process thereof

Abstract

The invention discloses a single-side double-layer copper substrate, which comprises a first line layer, an insulating layer, a second line layer, a glue layer and a copper base layer arranged in turnfrom top to bottom. The glue layer for connecting the second line layer and the copper base layer is applied at 15-25 microns and dried at 70-75 DEG C and then connected by thermoplastic lamination,which can avoid the problem that an FR4 line surface laminate is uneven and easy to layer and foam. Part of the glue layer fills a buried hole during lamination. A centrifugal membrane and a siliconepad are used for double protection during lamination, which prevents a blind hole and the buried hole from being unsaturated due to glue overflowing. The blind hole is closely connected with the copper base, which especially meets the ultra-high heat dissipation effect of components. The service life of the product is greatly prolonged, and the quality guarantee is improved.

Description

technical field [0001] The invention relates to the field of PCB boards, in particular to a single-side double-layer copper substrate and a manufacturing process thereof. Background technique [0002] Metal-based printed circuit boards (Metal Core PCB, MCPCB), the production process is becoming more and more complex, and the product function requirements are becoming more and more demanding. In the production process of single-sided double-layer copper-based circuit boards, the FR4 circuit boards are first produced, and then the circuit side is browned and then pressed together with the copper-based browned surface. [0003] However, ordinary double-layer one-sided lamination is used to laminate the copper on the other side of the FR4 single-sided circuit with the metal base to achieve quality standards. The use of ordinary press-bonded single-sided metal substrate process technology will result in poor reliability, especially prone to layering and blistering; the resin fil...

AI Technical Summary

Problems solved by technology

The use of ordinary press-bonded single-sided metal substrate process technology will result in poor reliability, especially prone to layering and blistering; the resin filling in the through hole used to connect the upper and lower conductive layers of FR4 is not full, and it is easy to hide tin after surface treatment. Beads, causing tin short circuit during surface mount (SMT), seriously affecting the quality function

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